Diffusion Bonding of Mg-AZ31B/Al-6061 and Characteristics with Pressure and with no Pressure

The study is diffusion bonding of Mg-AZ31 and Al-6061 under pressure and no pressure by using the direct bonding method. After bonding process, characteristics phase in interface and bonding boundaries of Mg-AZ31/Al-6061 were characterized . The diffusion formation was observed by SEM. Aluminum solid solution and Mg17Al12 alloy phase was proved by analysis of XRD. In the process of measurement, crystalline structure of nearby interface characteristics phase was analyzed in detail by TEM. Based on the above analysis, the crystal model of the magnesium alloy and aluminum alloys was established under pressure, and the bonding mechanism was discussed. The results show that the bonding materials could be bonded under no pressure and the structure of bonding interface is more optimized than pressure.

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Investigation of Bonding Interface and Strength Properties in Diffusion Bonding of MgAZ31/Al6061

Materials Science Forum ◽

10.4028/www.scientific.net/msf.750.160 ◽

2013 ◽

Vol 750 ◽

pp. 160-163

Author(s):

Ming Zhao ◽

Dong Ying Ju

Keyword(s):

Magnesium Alloy ◽

Aluminum Alloys ◽

Diffusion Bonding ◽

Strength Properties ◽

Bonding Process ◽

Bonding Interface ◽

Al 6061 ◽

Bonding Method ◽

Xrd Method

This paper is mainly a study the diffusion bonding of Mg-AZ31/Al-6061 by using the direct bonding method. After bonding process, multilayer field with Mg-Zn and Al-Zn have been confirmed by EPMA determination. Through the microstructure observed by SEM, bonding boundaries of Mg-AZ31/Al-6061 had good diffusion formation. The identification of the component on near interface was measured by XRD method. By using of these results, the mechanism of the magnesium alloy and aluminum alloys was discussed.

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Influence of Different Interlayers Metals on Properties of Diffusion Bonding Joint of Tungsten to Copper

Materials Science Forum ◽

10.4028/www.scientific.net/msf.620-622.65 ◽

2009 ◽

Vol 620-622 ◽

pp. 65-68 ◽

Cited By ~ 2

Author(s):

Jun Li ◽

Xu Fang ◽

Jian Feng Yang ◽

Guan Jun Qiao

Keyword(s):

Solid Solution ◽

Shear Strength ◽

Intermetallic Compound ◽

Diffusion Bonding ◽

Copper Alloy ◽

Bonding Temperature ◽

Liquid Solution ◽

Interfacial Bonding ◽

Bonding Mechanism ◽

Bonding Zone

Ti foil and Ni foil interlayers were selected for the bonding of tungsten to CuCrZr alloy. The effects of bonding temperature on the microstructures and shear strength of the joints were performed. The interfacial bonding mechanism was studied through microanalysis. The results show that Ti foil was transformed into liquid solution and extruded mostly out of the bonding zone at 980°C, the strength of the joints can reach 136MPa due to the chemical and mechanical interfacial bonding. Ni foil was used for bonding of tungsten to copper alloy, the EDS analyses shows that the solid solution Ni(W) and the intermetallic compound NiW2 form in the diffusion layer at 920°C.

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Diffusion Bonding of 3Y-TZP and SUS440 by Using of Ti-Cu Powder/Sheet

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.314-316.957 ◽

2011 ◽

Vol 314-316 ◽

pp. 957-962

Author(s):

Dong Ying Ju ◽

Ming Zhao

Keyword(s):

Residual Stress ◽

Stainless Steel ◽

Chemical Bonding ◽

Diffusion Bonding ◽

Bonding Process ◽

Bonding Interface ◽

Brass Powder ◽

Bonding Method ◽

Xrd Method

This paper is mainly a study the diffusion bonding of 3Y-TZP/SUS440 by using the chemical bonding method. In the bonding interface of 3Y-TZP and SUS440, the Ti-Cu (brass) powder/sheet was used as bonding materials. After bonding process, multi-alloy field with Fe-Ti and Fe-Cu have been confirmed by EPMA determination. Through the microstructure observed by AFM and SEM, bonding boundaries of 3Y-TZP/SUS440 by Ti-Cu powder/sheet had good formation. The distribution of the residual stress on near interface was measured by XRD method. By using of these results, the mechanism of the ceramic and stainless steel was discussed.

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High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.297-300.2819 ◽

2005 ◽

Vol 297-300 ◽

pp. 2819-2824 ◽

Cited By ~ 3

Author(s):

Ikuo Shohji ◽

Tsukasa Sakurai ◽

Shinji Arai

Keyword(s):

Surface Roughness ◽

High Frequency ◽

High Speed ◽

Bonding Process ◽

Bonding Mechanism ◽

Ultrasonic Bonding ◽

Bonding Properties ◽

The Wire ◽

Bonding Method ◽

Step Amplitude

High-speed ultrasonic bonding method has been developed to join resin-coated Cu wire on Sn electrodes for high-frequency chip coils. Two-step amplitude method, which decreases the ultrasonic amplitude in the bonding process, was effective to join the resin-coated Cu wire on Sn electrodes. The surface roughness treatment for a bonder head accelerated the deformation of the wire in the bonding process and improve the bondability compared to using the bonder head without that treatment. This paper also describes bonding properties of the joint and the bonding mechanism.

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Diffusion Bonding of Superplastic 7075 Aluminum Alloy

MRS Proceedings ◽

10.1557/proc-196-149 ◽

1990 ◽

Vol 196 ◽

Author(s):

Huang Yan ◽

Cui Jianzhong ◽

Ma Longxiang

Keyword(s):

Aluminum Alloy ◽

Base Metal ◽

Diffusion Bonding ◽

Joint Strength ◽

Bonding Process ◽

Special Method ◽

Bonding Mechanism ◽

7075 Aluminum Alloy ◽

Joint Microstructure ◽

Bond Interface

ABSTRACTBecause of the presence of surface oxide films, aluminum alloys are very difficult to join by diffusion bonding processes when there are no interlayers between mating surfaces. In the present investigation, the diffusion bonding of superplastic 7075 aluminum alloy has been carried out using a special method for surface treatment in the temperature range 500∼520°C, at pressures of 2.07∼3.OMPa, times of 90∼150min and a vaccum of 1×10−5torr. The joint strength obtained is the same as the base metal strength of the alloy, and the joint microstructure is indistinguishable from that of the base metal. In this paper, the effect of the superplastic treatment of the alloy on the bonding process is discussed, and it is proposed that the bonding mechanism is the migration of the initial bond interface caused both by the diffusion of atoms and by the growth of grains during the diffusion bonding process.

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Analysis of Bonging Temperature and Interfacial Characterization of 3Y-TZP and SUS304 by Diffusion Bonding

Materials Science Forum ◽

10.4028/www.scientific.net/msf.750.164 ◽

2013 ◽

Vol 750 ◽

pp. 164-167

Author(s):

Ming Zhao ◽

Dong Ying Ju

Keyword(s):

Residual Stress ◽

Stainless Steel ◽

Chemical Bonding ◽

Diffusion Bonding ◽

Electron Probe ◽

Bonding Process ◽

Electron Probe Micro Analyzer ◽

Bonding Method ◽

Xrd Method

This paper studies mainly the diffusion bonding of 3Y-TZP/SUS304 by using the chemical bonding method. In the bonding interface of 3Y-TZP and SUS304, the Ti-Cu powder/sheet was used as bonding materials. In bonding process, multi-alloy with Fe-Ti and Fe-Cu have been confirmed by Electron Probe Micro-Analyzer (EPMA) determination. Through the microstructure observed by AFM and SEM, bonding boundaries of 3Y-TZP/SUS304 by Ti-Cu powder/sheet had good formation. The distribution of the residual stress on near interface was measured by XRD method. By using of these results, the mechanism of the ceramic and stainless steel was discussed.

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Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless Steel

MATERIALS TRANSACTIONS ◽

10.2320/matertrans.m2015197 ◽

2015 ◽

Vol 56 (10) ◽

pp. 1683-1687 ◽

Cited By ~ 2

Author(s):

Takashi Harumoto ◽

Osamu Ohashi ◽

Hiroki Tsushima ◽

Miho Narui ◽

Kensaku Aihara ◽

...

Keyword(s):

Stainless Steel ◽

Thermal Stress ◽

Diffusion Bonding ◽

316L Stainless Steel ◽

Bonding Method

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Structure and Hardness of Cryorolled and Heat-Treated 2xxx Aluminum Alloy

Materials Science Forum ◽

10.4028/www.scientific.net/msf.667-669.925 ◽

2010 ◽

Vol 667-669 ◽

pp. 925-930

Author(s):

S.V. Krymskiy ◽

Elena Avtokratova ◽

M.V. Markushev ◽

Maxim Yu. Murashkin ◽

O.S. Sitdikov

Keyword(s):

Heat Treatment ◽

Solid Solution ◽

Plastic Deformation ◽

Aluminum Alloy ◽

Severe Plastic Deformation ◽

Coarse Grained ◽

Aging Response ◽

Heat Treated ◽

Aluminum Solid Solution ◽

A Cell

The effects of severe plastic deformation (SPD) by isothermal rolling at the temperature of liquid nitrogen combined with prior- and post-SPD heat treatment, on microstructure and hardness of Al-4.4%Cu-1.4%Mg-0.7%Mn (D16) alloy were investigated. It was found no nanostructuring even after straining to 75%. Сryodeformation leads to microshear banding and processing the high-density dislocation substructures with a cell size of ~ 100-200 nm. Such a structure remains almost stable under 1 hr annealing up to 200oC and with further temperature increase initially transforms to bimodal with a small fraction of nanograins and then to uniform coarse grained one. It is found the change in the alloy post–SPD aging response leading to more active decomposition of the preliminary supersaturated aluminum solid solution, and to the alloy extra hardening under aging with shorter times and at lower temperatures compared to T6 temper.

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