Development of Solvent Inclusion Free 4H-SiC Off-Axis Wafer Grown by the Top-Seeded Solution Growth Technique
2018 ◽
Vol 924
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pp. 31-34
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Keyword(s):
This study reports our newly developed technology for SiC solution growth. In particular, we succeed in completely suppressing solvent inclusions, which have been a serious technological problem peculiar to the solution growth method. Then, we fabricate two-inch-diameter 4° off-axis SiC wafers without solvent inclusions. Moreover, we performed their crystal defects evaluation. It was found that our wafers were low resistance n-type 4H-SiC and contain almost no basal plane dislocation. As a result, the superior quality of our solution-grown crystal was confirmed.
2010 ◽
Vol 645-648
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pp. 33-36
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Keyword(s):
2019 ◽
Vol 963
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pp. 75-79
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Keyword(s):
2015 ◽
Vol 62
(6)
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pp. 1016-1021
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1995 ◽
Vol 30
(4)
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pp. 499-505
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2006 ◽
Vol 292
(2)
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pp. 454-457
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2014 ◽
Vol 392
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pp. 60-65
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