koh etching
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2021 ◽  
Vol 2086 (1) ◽  
pp. 012037
Author(s):  
K Yu Shubina ◽  
D V Mokhov ◽  
T N Berezovskaya ◽  
E V Pirogov ◽  
A V Nashchekin ◽  
...  

Abstract In this work, the AlN/Si(111) epitaxial structures grown consistently by plasma assisted molecular beam epitaxy (PA MBE) and hydride vapour phase epitaxy (HVPE) methods were studied. The PA MBE AlN buffer layers were synthesized via coalescence overgrowth of self-catalyzed AlN nanocolumns on Si(111) substrates and were used as templates for further HVPE growth of thick AlN layer. It was shown that described approaches can be used to obtain AlN layers with sufficiently smooth morphology. It was found that HVPE AlN inherited crystallographic polarity of the AlN layer grown by PA MBE. It was demonstrated that the etching of such AlN/Si(111) epitaxial structures results in partial separation of the AlN epilayers from the Si(111) substrate and allows to form suspended structures. Moreover, the avoidance of surface damage and backside overetching was achieved by use thin Cr film as surface protective coating and by increasing the layer thickness accordingly.


2021 ◽  
Vol 2103 (1) ◽  
pp. 012098
Author(s):  
V V Lendyashova ◽  
K P Kotlyar ◽  
V O Gridchin ◽  
R R Reznik ◽  
A I Lihachev ◽  
...  

Abstract The possibility of the controlled removal of GaN nanowires (NWs) from an SiOx inhibitor layer of patterned SiOx/Si substrates has been demonstrated. It has been found that the wet KOH etching preserves the selectively grown GaN NWs on Si surface, whereas the GaN NWs grown on inhibitor SiOx layer are removing. The effect is described by the difference in polarity between GaN NWs grown on a Si surface and NWs grown on a SiOx inhibitor layer.


2021 ◽  
Vol MA2021-02 (34) ◽  
pp. 1005-1005
Author(s):  
Hrishikesh Das ◽  
Swapna Sunkari ◽  
Joshua Justice ◽  
Danielle Hamann ◽  
Tamzin Lafford ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (19) ◽  
pp. 5890
Author(s):  
Hejing Wang ◽  
Jinying Yu ◽  
Guojie Hu ◽  
Yan Peng ◽  
Xuejian Xie ◽  
...  

Micropipe, a “killer” defect in SiC crystals, severely hampers the outstanding performance of SiC-based devices. In this paper, the etching behavior of micropipes in 4H-SiC and 6H-SiC wafers was studied using the molten KOH etching method. The spectra of 4H-SiC and 6H-SiC crystals containing micropipes were examined using Raman scattering. A new Raman peak accompanying micropipes located near −784 cm−1 was observed, which may have been induced by polymorphic transformation during the etching process in the area of micropipe etch pits. This feature may provide a new way to distinguish micropipes from other defects. In addition, the preferable etching conditions for distinguishing micropipes from threading screw dislocations (TSDs) was determined using laser confocal microscopy, scanning electron microscopy (SEM) and optical microscopy. Meanwhile, the micropipe etching pits were classified into two types based on their morphology and formation mechanism.


2021 ◽  
Vol 104 (7) ◽  
pp. 141-146
Author(s):  
Hrishikesh Das ◽  
Swapna Sunkari ◽  
Joshua Justice ◽  
Danielle Hamann ◽  
Tamzin Lafford ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (16) ◽  
pp. 4400
Author(s):  
Cristiano Calabretta ◽  
Viviana Scuderi ◽  
Ruggero Anzalone ◽  
Marco Mauceri ◽  
Danilo Crippa ◽  
...  

This work provides a comprehensive investigation of nitrogen and aluminum doping and its consequences for the physical properties of 3C-SiC. Free-standing 3C-SiC heteroepitaxial layers, intentionally doped with nitrogen or aluminum, were grown on Si (100) substrate with different 4° off-axis in a horizontal hot-wall chemical vapor deposition (CVD) reactor. The Si substrate was melted inside the CVD chamber, followed by the growth process. Micro-Raman, photoluminescence (PL) and stacking fault evaluation through molten KOH etching were performed on different doped samples. Then, the role of the doping and of the cut angle on the quality, density and length distribution of the stacking faults was studied, in order to estimate the influence of N and Al incorporation on the morphological and optical properties of the material. In particular, for both types of doping, it was observed that as the dopant concentration increased, the average length of the stacking faults (SFs) increased and their density decreased.


2021 ◽  
Vol 1963 (1) ◽  
pp. 012009
Author(s):  
Alwan M Alwan ◽  
Ali A. Youssef ◽  
Aseel A. Chasb

Author(s):  
Shiying Zhang ◽  
Lei Zhang ◽  
Yueyao Zhong ◽  
Guodong Wang ◽  
Qingjun Xu

High crystal quality GaN nanorod arrays were fabricated by inductively coupled plasma (ICP) etching using self-organized nickel (Ni) nano-islands mask on GaN film and subsequent repaired process including annealing in ammonia and KOH etching. The Ni nano-islands have been formed by rapid thermal annealing, whose density, shape, and dimensions were regulated by annealing temperature and Ni layer thickness. The structural and optical properties of the nanorods obtained from GaN epitaxial layers were comparatively studied by high-resolution X-ray diffraction (HRXRD), Raman spectroscopy and photoluminescence (PL). The results indicate that damage induced by plasma can be successfully healed by annealing in NH3 at 900 °C. The average diameter of the as-etched nanorod was effectively reduced and the plasma etch damage was removed after a wet treatment process in a KOH solution. It was found that the diameter of the GaN nanorod was continuously reduced and the PL intensity first increased, then reduced and finally increased as the KOH etching time sequentially increased.


2020 ◽  
Vol 525 ◽  
pp. 146532 ◽  
Author(s):  
Yi Zhang ◽  
Hongyingnan Chen ◽  
Dianzi Liu ◽  
Hui Deng
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