Ag wire and Ag alloy wire reliability and molding compounds

2013 ◽  
Vol 2013 (1) ◽  
pp. 000045-000049 ◽  
Author(s):  
Aya Mizushima ◽  
Shinichiro Kato ◽  
Hidenori Abe ◽  
Naoki Sadayori ◽  
Yoshinori Endo ◽  
...  

Ag wire and Ag alloy wire reliability experiments were conducted on both 28-lead SOP and 96-pin PBGA packages. Biased HAST (b-HAST) of Ag-wired packages with higher ion content molding compouds generated obvious defects promoted by ion accumulation mechanism. Intermetallic compounds (IMCs) at the corroded interface are identified using cross-sectional TEM/EDX. Ion selective affinity of intermetallic compound is rationalized using ab initio molecular dynamics simulation.

2003 ◽  
Vol 118 (8) ◽  
pp. 3639-3645 ◽  
Author(s):  
Markus Kreitmeir ◽  
Helmut Bertagnolli ◽  
Jens Jørgen Mortensen ◽  
Michele Parrinello

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