Ag wire and Ag alloy wire reliability and molding compounds
2013 ◽
Vol 2013
(1)
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pp. 000045-000049
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Keyword(s):
Ag wire and Ag alloy wire reliability experiments were conducted on both 28-lead SOP and 96-pin PBGA packages. Biased HAST (b-HAST) of Ag-wired packages with higher ion content molding compouds generated obvious defects promoted by ion accumulation mechanism. Intermetallic compounds (IMCs) at the corroded interface are identified using cross-sectional TEM/EDX. Ion selective affinity of intermetallic compound is rationalized using ab initio molecular dynamics simulation.
2008 ◽
Vol 112
(25)
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pp. 7566-7573
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2004 ◽
Vol 47
(7)
◽
pp. 92
◽
2003 ◽
Vol 118
(8)
◽
pp. 3639-3645
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2020 ◽
Vol 816
◽
pp. 152680
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2019 ◽
Vol 279
◽
pp. 306-316
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