High Heat Flux, Gravity-Independent, Two-Phase Heat Exchangers for Spacecraft Thermal Management

2002 ◽  
Author(s):  
Jason Bower ◽  
James F. Klausner ◽  
Siddartha Sathyanarayan
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Exchangers ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase

Model Predictive Control of a Pumped Two-Phase Cooling System With Microchannel Heat Exchangers

2018 ◽  
Author(s):  
Oyuna Angatkina ◽  
Andrew Alleyne
Keyword(s):  
Heat Flux ◽  
Model Predictive Control ◽  
Predictive Control ◽  
Heat Exchangers ◽  
Cooling System ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase ◽  
Cooling Systems ◽  
Two Phase Cooling

Two-phase cooling systems provide a viable technology for high–heat flux rejection in electronic systems. They provide high cooling capacity and uniform surface temperature. However, a major restriction of their application is the critical heat flux condition (CHF). This work presents model predictive control (MPC) design for CHF avoidance in two-phase pump driven cooling systems. The system under study includes multiple microchannel heat exchangers in series. The MPC controller performance is compared to the performance of a baseline PI controller. Simulation results show that while both controllers are able to maintain the two-phase cooling system below CHF, MPC has significant reduction in power consumption compared to the baseline controller.

Thermal Management of On-Chip Hot Spot

2012 ◽  
Vol 134 (5) ◽  
Author(s):  
Avram Bar-Cohen ◽  
Peng Wang
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Switching Speed ◽  
Two Phase ◽  
Advantages And Disadvantages ◽  
On Chip

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. The application of on-chip high flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric micro-coolers and two-phase microgap coolers. The advantages and disadvantages of these on-chip cooling solutions for high heat flux hot spots are evaluated and compared.

Vapor-Venting, Micromachined Heat Exchanger for Electronics Cooling

2007 ◽  
Author(s):  
Milnes P. David ◽  
Tarun Khurana ◽  
Carlos Hidrovo ◽  
Beth L. Pruitt ◽  
Kenneth E. Goodson
Keyword(s):  
Heat Flux ◽  
Heat Exchanger ◽  
Heat Exchangers ◽  
High Efficiency ◽  
Electronics Cooling ◽  
High Heat ◽  
High Heat Flux ◽  
Water Mixture ◽  
Hydrophobic Membrane ◽  
Two Phase

The increasing complexity of modern integrated circuits and need for high-heat flux removal with low junction temperatures motivates research in a wide variety of cooling and refrigeration technologies. Two-phase liquid cooling is especially attractive due to high efficiency and low thermal resistances. While two-phase microfluidic cooling offers important benefits in required flow rate and pump size, there are substantial challenges related to flow stability and effective superheating. This work investigates the use of hydrophobic membrane to locally vent the vapor phase in microfluidic heat exchangers. Previous work has demonstrated selective venting of gas in microstructures and we extend this concept to two-phase heat exchangers. This paper details the design, fabrication and preliminary testing of the novel heat exchanger. Proof-of-concept of the device, carried out using an isothermal air-water mixture, found the air-mass venting efficiency exceeding 95%. Two-phase, thermal operation of the heat exchanger found the pressure-drop to be smaller compared to a two-phase, non-venting model. The paper also includes a discussion of design challenges such as membrane leakage and optical inaccessibility. The favorable results demonstrated in this first-generation, vapor-venting, micromachined, heat exchanger motivates further study of this and other novel microstructures aimed at mitigating the negative effects of phase-change. With continued research and optimization, we believe two-phase cooling is a viable solution for high heat flux generating electronics.

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