2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Singularities at solder joint interfaces and their effects on fracture models: Part II

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544342 ◽

2008 ◽

Author(s):

D. Bhate ◽

G. Subbarayan ◽

L. Nguyen ◽

J. Zhao

Keyword(s):

Solder Joint ◽

Fracture Models

Download Full-text

Effects of reflow atmosphere on solder void and wire bond performances in a PQFN package

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544362 ◽

2008 ◽

Cited By ~ 2

Author(s):

Youmin Yu ◽

S. A. Yao ◽

G. J. Lv ◽

Wei Xiao ◽

Sonder Wang ◽

...

Keyword(s):

Wire Bond

Download Full-text

An assessment of air cooling for use with automotive power electronics

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544251 ◽

2008 ◽

Cited By ~ 2

Author(s):

Desikan Bharathan ◽

Kenneth Kelly

Keyword(s):

Power Electronics ◽

Air Cooling

Download Full-text

Numerical and experimental investigations of boiling enhancement in buoyancy-driven microchannels

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544255 ◽

2008 ◽

Cited By ~ 2

Author(s):

Karl J.L. Geisler ◽

Avram Bar-Cohen

Keyword(s):

Experimental Investigations ◽

Boiling Enhancement

Download Full-text

Study on the natural air cooling design of electronic equipment casings: Effects of the height and size of outlet vent on the flow resistance

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544316 ◽

2008 ◽

Author(s):

Masaru ishizuka ◽

Shinji Nakagawa

Keyword(s):

Flow Resistance ◽

Electronic Equipment ◽

Air Cooling ◽

Cooling Design

Download Full-text

Heat transport characteristics of capillary pumped loop with plate-type evaporator

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544247 ◽

2008 ◽

Cited By ~ 1

Author(s):

Atsushi Tsujimori ◽

Kosuke Hirata ◽

Kentaro Nakaguchi ◽

Maiko Uchida

Keyword(s):

Heat Transport ◽

Capillary Pumped Loop ◽

Plate Type

Download Full-text

Mixed convection cooling of a microsphere

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544385 ◽

2008 ◽

Author(s):

Mohamed A. Antar

Keyword(s):

Mixed Convection ◽

Convection Cooling

Download Full-text

Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544351 ◽

2008 ◽

Cited By ~ 8

Author(s):

Takashi Anzawa ◽

Qiang Yu ◽

Masanori Yamagiwa ◽

Tadahiro Shibutani ◽

Masaki Shiratori

Keyword(s):

Reliability Evaluation ◽

Mechanical Analysis ◽

Power Device ◽

Cycle Fatigue ◽

Fatigue Reliability ◽

Power Cycle ◽

Thermal Mechanical Analysis

Download Full-text

Evaporation-enhanced, dynamically-adaptive air (gas)-cooled heat sink for thermal management of high heat dissipation devices

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544288 ◽

2008 ◽

Author(s):

Andrei G. Fedorov ◽

J. Mark Meacham

Keyword(s):

Thermal Management ◽

Heat Sink ◽

Heat Dissipation ◽

High Heat

Download Full-text

Die stress variation in area array components subjected to accelerated life testing

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544337 ◽

2008 ◽

Cited By ~ 4

Author(s):

Jordan C. Roberts ◽

M. Kaysar Rahim ◽

Safina Hussain ◽

Jeffrey C. Suhling ◽

Richard C. Jaeger ◽

...

Keyword(s):

Accelerated Life Testing ◽

Life Testing ◽

Stress Variation ◽

Area Array ◽

Accelerated Life ◽

Die Stress

Download Full-text

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Singularities at solder joint interfaces and their effects on fracture models: Part II

Effects of reflow atmosphere on solder void and wire bond performances in a PQFN package

An assessment of air cooling for use with automotive power electronics

Numerical and experimental investigations of boiling enhancement in buoyancy-driven microchannels

Study on the natural air cooling design of electronic equipment casings: Effects of the height and size of outlet vent on the flow resistance

Heat transport characteristics of capillary pumped loop with plate-type evaporator

Mixed convection cooling of a microsphere

Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis

Evaporation-enhanced, dynamically-adaptive air (gas)-cooled heat sink for thermal management of high heat dissipation devices

Die stress variation in area array components subjected to accelerated life testing

Export Citation Format

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Singularities at solder joint interfaces and their effects on fracture models: Part II

Effects of reflow atmosphere on solder void and wire bond performances in a PQFN package

An assessment of air cooling for use with automotive power electronics

Numerical and experimental investigations of boiling enhancement in buoyancy-driven microchannels

Study on the natural air cooling design of electronic equipment casings: Effects of the height and size of outlet vent on the flow resistance

Heat transport characteristics of capillary pumped loop with plate-type evaporator

Mixed convection cooling of a microsphere

Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis

Evaporation-enhanced, dynamically-adaptive air (gas)-cooled heat sink for thermal management of high heat dissipation devices

Die stress variation in area array components subjected to accelerated life testing

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Latest Publications