scholarly journals Electromagnetic Forming Process Analysis Based on Coupled Simulations of Electromagnetic Analysis and Structural Analysis

2016 ◽  
Vol 21 (2) ◽  
pp. 215-221 ◽  
Author(s):  
Man Gi Lee ◽  
Seung Hwan Lee ◽  
Sunwoo Kim ◽  
Jin Ho Kim
2008 ◽  
Vol 575-578 ◽  
pp. 174-179
Author(s):  
Juan Hua Su ◽  
Feng Zhang Ren ◽  
Lei Wang

This paper analyzes the forming process methods of fin used in CPU chip to emit heat. The whole process is blanking, the first forging forming, the second forging (sizing), and trimming. The chamfer design of CPU fin blank is simulated by finite element analysis. The optimized chamfer 1.6 mm is available. Semi-enclosed cold forging of progressive dies is put forward. The newly designed transfer unit is applied, which unifies the merit of high efficiency of the progressive dies and the high material-using ratio of the project die. Quick disassembly structure is designed and pins are used as quick disassembly pins by means of ball bearing bushing. The unique processing of the shearing scrap structure is adopted when designing the inverted trimming dies. Compared with the traditional die, the mechanization and electrization are realized to increase the production efficiency and get highly precise CPU fin.


2021 ◽  
Vol 70 ◽  
pp. 140-151
Author(s):  
Quanliang Cao ◽  
Xian Li ◽  
Zhenhao Li ◽  
Limeng Du ◽  
Liangyu Xia ◽  
...  

2021 ◽  
Author(s):  
Shuwen Wen ◽  
Jun Li ◽  
Zhuozhi Fan ◽  
Shu Yan Zhang ◽  
Peng Zhang ◽  
...  

2019 ◽  
Vol 166 ◽  
pp. 773-784 ◽  
Author(s):  
Abderrahmen Aridhi ◽  
Makrem Arfaoui ◽  
Tarek Mabrouki ◽  
Naim Naouar ◽  
Yvan Denis ◽  
...  

2019 ◽  
Vol 33 (6) ◽  
pp. 2809-2815 ◽  
Author(s):  
Seung-Min Tak ◽  
Han-Bin Kang ◽  
In-Seok Baek ◽  
Seok-Soon Lee

2015 ◽  
Vol 19 ◽  
pp. 171-182 ◽  
Author(s):  
Weiren Xiong ◽  
Wenping Wang ◽  
Min Wan ◽  
Xinjun Li

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