The Architecture of the Digital Device for Round-The-Clock Surveillance

2012 ◽  
Vol 7 (3) ◽  
pp. 129-136
Author(s):  
Aleksandr Golitsyn ◽  
Natalya Seyfi
Keyword(s):  
Image Processing ◽  
Printed Circuit Board ◽  
Processing System ◽  
Image Sensor ◽  
Circuit Board ◽  
Digital Device ◽  
Printed Circuit ◽  
Hardware Development ◽  
Low Luminance ◽  
Processing Module

The article describes the hardware development of the image processing system which is used as a viewer in digital day-and-night surveillance device. During the work the most suitable image sensor for the surveillance in low luminance conditions is selected, image processing module based on FPGA is developed and the printed circuit board of the device is designed

scholarly journals Defect Detection in Printed Board Circuit using Image Processing

2019 ◽  
Vol 9 (2) ◽  
pp. 3005-3010
Keyword(s):  
Machine Learning ◽  
Image Processing ◽  
Defect Detection ◽  
Printed Circuit Board ◽  
Learning Algorithms ◽  
Machine Learning Algorithms ◽  
Circuit Board ◽  
Basic Part ◽  
Printed Circuit ◽  
Related Information

A printed circuit board without connecting with any components called as a bare PCB. Consider a PCB as a basic part which has been settled with more electronic units. In order to display the manufacturing process, the drawbacks have been taken by PCB individually. The reflection of this separation process impacts the performance of the circuits. Also, we have examined about classification methodologies as well as referential based PCB detection. From the input images, the needed and related information has been pulled out using image processing methodologies by the referential based PCB detection. Comparing with the un-defected PCB images, this was used to find out the defects. To meet the goal of the PCB defect detection, several feature extraction and pre-processing methods are derived in this article. The PCB defects have been classified by those features using the machine learning algorithms. Moreover, several types of machine learning algorithms are derived in this article. This paper helps the researchers for achieving a better solution for image processing and machine learning-based printed circuit board the defect classification

Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes

2016 ◽  
Vol 28 (1) ◽  
pp. 2-6 ◽  
Author(s):  
Balázs Illés ◽  
Olivér Krammer ◽  
Attila Géczy ◽  
Tamás Garami
Keyword(s):  
Image Processing ◽  
Printed Circuit Board ◽  
Quality Parameters ◽  
Circuit Board ◽  
Temperature Sensitive ◽  
Electrical Measurements ◽  
Content Type ◽  
Printed Circuit ◽  
The Mean ◽  
Mean Intercept Length

Purpose – The purpose of this paper is to present a novel and alternative method for the characterization of isotropic conductive adhesive (ICA) joints’ conductivity by the calculation of the mean intercept length of conductive flakes in the cured joint. ICAs are widely used in the field of hybrid electronics or special printed circuit board applications, such as temperature sensitive or flexible circuits. The main quality parameters of the ICA joints are the conductivity and the mechanical strength. Design/methodology/approach – For the experiments, one-component Ag-filled thermoset ICA paste was used on FR4 printed circuit test board to join zero-ohm resistors. Six different curing temperatures were applied: 120, 150, 175, 210, 230 and 250°C. The conductivity of the joints was measured in situ during the curing process. Micrographs were taken from the cross-sectioned joints, and the mean intercept length was calculated on them after image processing steps. Findings – Results of the measured conductivity and the mean intercept length were compared, and acceptable correlation was found for what can be used for characterizing the conductibility of ICA joints. Research limitations/implications – Investigating and characterizing the conductivity of ICA joints by an image processing method. Originality/value – The main advantage of this method compared to the electrical measurements is that the conductivity characterization is possible on any kind of component. Therefore, this method can be used in any appliances not only in test circuits.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission
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