Electrochemical study of multi-component additive behavior during copper electrodeposition with a microfluidic device and an electrochemical quartz crystal microbalance
2015 ◽
Vol 54
(5S)
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pp. 05EA04
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1999 ◽
Vol 463
(2)
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pp. 224-231
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2004 ◽
Vol 569
(1)
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pp. 61-70
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2014 ◽
Vol 53
(5S2)
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pp. 05GA05
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1997 ◽
Vol 440
(1-2)
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pp. 65-72
1997 ◽
Vol 440
(1-2)
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pp. 139-143
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2002 ◽
Vol 3
(5)
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pp. 456
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