Si on SiO2 by Solid-State Diffusion Bonding (SSDB) Technology

Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2016.2626794 ◽

2017 ◽

Vol 7 (1) ◽

pp. 19-26 ◽

Cited By ~ 5

Author(s):

Junqiang Wang ◽

Qian Wang ◽

Zijian Wu ◽

Dejun Wang ◽

Jian Cai

Keyword(s):

Solid State ◽

Diffusion Bonding ◽

Solid State Diffusion ◽

Wafer Level ◽

Fine Pitch ◽

State Diffusion ◽

Cu Interconnect

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Solid-State Diffusion Bonding of Glass-Metal for the International Thermonuclear Experimental Reactor (ITER) Diagnostic Windows

TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings - The Minerals, Metals & Materials Series ◽

10.1007/978-3-030-36296-6_191 ◽

2020 ◽

pp. 2085-2094

Author(s):

Lee Aucott ◽

Rob Bamber ◽

Artem Lunev ◽

Tim Darby ◽

Philippe Maquet ◽

...

Keyword(s):

Solid State ◽

Diffusion Bonding ◽

International Thermonuclear Experimental Reactor ◽

Solid State Diffusion ◽

Experimental Reactor ◽

State Diffusion ◽

Glass Metal

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Laser properties of Fe2+:ZnSe fabricated by solid-state diffusion bonding

Laser Physics Letters ◽

10.1088/1612-202x/aaa93f ◽

2018 ◽

Vol 15 (4) ◽

pp. 045806 ◽

Cited By ~ 12

Author(s):

S S Balabanov ◽

K N Firsov ◽

E M Gavrishchuk ◽

V B Ikonnikov ◽

S Yu Kazantsev ◽

...

Keyword(s):

Solid State ◽

Diffusion Bonding ◽

Solid State Diffusion ◽

State Diffusion

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Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF)

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654313 ◽

2018 ◽

Author(s):

Kelvin P. L. Pun ◽

Jason Rotanson ◽

Navdeep S. Dhaka ◽

Chee-Wah Cheung ◽

Alan H. S. Chan

Keyword(s):

Free Surface ◽

Solid State ◽

Diffusion Bonding ◽

Surface Finishing ◽

Solid State Diffusion ◽

Fine Pitch ◽

State Diffusion ◽

Chip On Film

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Room-temperature lasing on Fe2+:ZnSe with meniscus inner doped layer fabricated by solid-state diffusion bonding

Laser Physics Letters ◽

10.1088/1612-202x/ab09e8 ◽

2019 ◽

Vol 16 (5) ◽

pp. 055004 ◽

Cited By ~ 7

Author(s):

S S Balabanov ◽

K N Firsov ◽

E M Gavrishchuk ◽

V B Ikonnikov ◽

I G Kononov ◽

...

Keyword(s):

Solid State ◽

Diffusion Bonding ◽

Room Temperature ◽

Solid State Diffusion ◽

State Diffusion

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Low temperature solid-state-diffusion bonding for fine-pitch Cu/Sn/Cu interconnect

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159813 ◽

2015 ◽

Cited By ~ 5

Author(s):

Jian Cai ◽

Junqiang Wang ◽

Qian Wang ◽

Ziyu Liu ◽

Dejun Wang ◽

...

Keyword(s):

Solid State ◽

Low Temperature ◽

Diffusion Bonding ◽

Solid State Diffusion ◽

Fine Pitch ◽

State Diffusion ◽

Cu Interconnect

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IR laser active elements fabricated by Solid-State Diffusion Bonding

2018 International Conference Laser Optics (ICLO) ◽

10.1109/lo.2018.8435857 ◽

2018 ◽

Author(s):

S.S. Balabanov ◽

K.N. Firsov ◽

E.M. Gavrishchuk ◽

V.B. Ikonnikov ◽

S.Yu. Kazantsev ◽

...

Keyword(s):

Solid State ◽

Diffusion Bonding ◽

Solid State Diffusion ◽

Active Elements ◽

Ir Laser ◽

State Diffusion

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Modelling solid-state diffusion bonding

Acta Metallurgica ◽

10.1016/0001-6160(89)90040-0 ◽

1989 ◽

Vol 37 (9) ◽

pp. 2425-2437 ◽

Cited By ~ 133

Author(s):

A. Hill ◽

E.R. Wallach

Keyword(s):

Solid State ◽

Diffusion Bonding ◽

Solid State Diffusion ◽

State Diffusion

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Modelling of Solid-State Diffusion Bonding with a Real Rough Surface

Materials Science Forum ◽

10.4028/www.scientific.net/msf.475-479.3185 ◽

2005 ◽

Vol 475-479 ◽

pp. 3185-3188 ◽

Cited By ~ 1

Author(s):

G.Q. Wu ◽

Z. Huang ◽

Han Yun Li

Keyword(s):

Theoretical Model ◽

Solid State ◽

Diffusion Bonding ◽

Bonding Process ◽

Solid State Diffusion ◽

Diffusion Distance ◽

State Diffusion ◽

Definite Time ◽

Visualization And Simulation ◽

Bonding Surface

By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The model, reflecting the characteristic of real bonding process effectively, realizes the visualization and simulation of the bonding process in which many voids disappear dynamically. The results show that the simulation is close to those experimental results from the phenomena of voids closure.

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