Back-to-back substrate wafer bonding: A new approach to the fabrication of double-side coated wafers
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1999 ◽
Vol 173
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pp. 185-188
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1973 ◽
Vol 31
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pp. 698-699
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1985 ◽
Vol 43
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pp. 714-715
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1989 ◽
Vol 47
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pp. 76-77