scholarly journals Elimination of Non-stick on Leads Defect through Re-designed WCTP

2021 ◽  
pp. 22-26
Author(s):  
Richard G. Mariano ◽  
Alyssa Grace S. Gablan ◽  
Frederick Ray I. Gomez
Keyword(s):  
Positive Bias ◽  
Defect Reduction ◽  
The Reformation ◽  
Hollow Part ◽  
The Wire ◽  
Bouncing Effect ◽  
High Rejection

This paper presents the reformation and fabrication resolved on the wire clamp and top plate (WCTP) design to eliminate the presence of lead finger bouncing resulting to high rejection of non-stick on leads (NSOL). Problem experienced was that the hollow or half-etched portion of the leadframe at the top and bottom units caused its bouncing effect. With the aim to improve localized massive NSOL defect, WCTP has been modified to provide positive bias to support its hollow part or the half-etched part of the leadframe at the top and bottom of the units. The re-designed WCTP was fabricated, extending its clamping with enhanced vacuum on top and bottom rows. The implementation of the improved WCTP design reduced the defect with 88 % improvement with the defect reduction during the lot runs.

scholarly journals Elimination of Smashed Ball Defect through Process and Design Improvement

2020 ◽  
pp. 39-43
Author(s):  
Jonathan C. Pulido ◽  
Rennier S. Rodriguez ◽  
Frederick Ray I. Gomez
Keyword(s):  
Design Improvement ◽  
Micro Holes ◽  
Micro Hole ◽  
The Wire ◽  
Bouncing Effect

This paper presents the modification and improvement done on the wire clamp and top plate (WCTP) design to eliminate the bouncing effect of the silicon die that leads to smashed ball reject during the formation of wire. The protrusion of the unit on the vacuum hole produced movement and slight vibration that affects the consistency of wirebonding. Through changing the standard vacuum hole to micro-holes provides underneath support to the unit and eliminates the overhanging or protrusion during the formation of wire. The implementation of the micro-hole design reduced the defect parts per million (dppm) occurrence to zero.

Microstructural Development in Nb-Ti Multifilamentary Superconductors During Processing

1985 ◽  
Vol 43 ◽  
pp. 190-191
Author(s):  
A. W. West
Keyword(s):  
Heat Treatment ◽  
Critical Current Density ◽  
Copper Matrix ◽  
Wire Drawing ◽  
Heat Treatments ◽  
Microstructural Development ◽  
Final Size ◽  
Density Values ◽  
The Wire ◽  
Multifilamentary Superconductors

The influence of the filament microstructure on the critical current density values, Jc, of Nb-Ti multifilamentary superconducting composites has been well documented. However the development of these microstructures during composite processing is still under investigation.During manufacture, the multifilamentary composite is given several heat treatments interspersed in the wire-drawing schedule. Typically, these heat treatments are for 5 to 80 hours at temperatures between 523 and 573K. A short heat treatment of approximately 3 hours at 573K is usually given to the wire at final size. Originally this heat treatment was given to soften the copper matrix, but recent work has shown that it can markedly change both the Jc value and microstructure of the composite.

Defect reduction in oxygen implanted silicon-on-insulator material during high-temperature annealing

1989 ◽  
Vol 47 ◽  
pp. 604-605
Author(s):  
P. Roitman ◽  
B. Cordts ◽  
S. Visitserngtrakul ◽  
S.J. Krause
Keyword(s):  
High Temperature ◽  
Annealing Temperature ◽  
Silicon On Insulator ◽  
High Dose ◽  
High Temperature Annealing ◽  
High Current ◽  
Defect Reduction ◽  
Annealing Step ◽  
Multiple Cycle ◽  
Defect Densities

Synthesis of a thin, buried dielectric layer to form a silicon-on-insulator (SOI) material by high dose oxygen implantation (SIMOX – Separation by IMplanted Oxygen) is becoming an important technology due to the advent of high current (200 mA) oxygen implanters. Recently, reductions in defect densities from 109 cm−2 down to 107 cm−2 or less have been reported. They were achieved with a final high temperature annealing step (1300°C – 1400°C) in conjunction with: a) high temperature implantation or; b) channeling implantation or; c) multiple cycle implantation. However, the processes and conditions for reduction and elimination of precipitates and defects during high temperature annealing are not well understood. In this work we have studied the effect of annealing temperature on defect and precipitate reduction for SIMOX samples which were processed first with high temperature, high current implantation followed by high temperature annealing.

Use of the AO Wire Passer to Aid Placement of Obstetrical Saw Wire for Osteotomy

1994 ◽  
Vol 07 (04) ◽  
pp. 180-182
Author(s):  
N. Gofton ◽  
Joanne Cockshutt
Keyword(s):  
Soft Tissue ◽  
Close Contact ◽  
Soft Tissue Trauma ◽  
Wire Saw ◽  
Tissue Dissection ◽  
The Wire ◽  
Tissue Trauma

The AO wire passer can be used as an effective guide for passage of obstetrical saw wire for osteotomy. Use of the wire saw and passer reduces soft tissue trauma by minimizing tissue dissection, and promoting positioning of the saw in close contact with the bone.

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