lateral oxidation
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2019 ◽  
Vol 1 (5) ◽  
pp. 305-310 ◽  
Author(s):  
Vidya S. Kaushik ◽  
Erika Rohr ◽  
Sangjin Hyun ◽  
Stefan De Gendt ◽  
Sven Van Elshocht ◽  
...  

2018 ◽  
Vol 34 (1) ◽  
pp. 015014 ◽  
Author(s):  
Stephane Calvez ◽  
Alexandre Arnoult ◽  
Antoine Monmayrant ◽  
Henri Camon ◽  
Guilhem Almuneau

2018 ◽  
Vol 8 (7) ◽  
pp. 1762 ◽  
Author(s):  
Stephane Calvez ◽  
Gaël Lafleur ◽  
Alexandre Arnoult ◽  
Antoine Monmayrant ◽  
Henri Camon ◽  
...  
Keyword(s):  

2016 ◽  
Author(s):  
S. Calvez ◽  
G. Lafleur ◽  
C. Arlotti ◽  
A. Larrue ◽  
P.-F. Calmon ◽  
...  

2016 ◽  
Author(s):  
Majid Riaziat ◽  
David Reed ◽  
Alex Kor
Keyword(s):  

2013 ◽  
Vol 49 (9) ◽  
pp. 731-738 ◽  
Author(s):  
Sheila P. Nabanja ◽  
Leslie A. Kolodziejski ◽  
Gale S. Petrich

2011 ◽  
Vol 483 ◽  
pp. 565-568
Author(s):  
Xiao Fei Wang ◽  
Yu Fei Zhang ◽  
Kan Yu ◽  
Xiao Mei Yu

In this paper, we report a method of fabricating silicon nano-wire based on thermal oxidation technique. In this method, we first fabricate a wider structure with traditional lithography, and then use a layer of silicon nitride as mask to oxidize silicon. At the same time, due to the lateral diffusion and oxidation of oxidant, silicon is consumed by oxidant and the width of the silicon structure will be reduced to nano range when we remove the silicon dioxide. The factors affecting the ratio of vertical and lateral oxidation, for example, the gentle slope caused by isotropic oxidation and the inhomogeneity of the sidewall of silicon nano-wire, are discussed at last. Our results should be useful in generating silicon–based nanospintronics devices with careful selection of the oxide parameters.


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