Threshold Voltage Control in PMOSFETs with Polysilicon or Fully-Silicided Gates on Hf-Based Gate Dielectric Using Controlled Lateral Oxidation

2019 ◽  
Vol 1 (5) ◽  
pp. 305-310 ◽  
Author(s):  
Vidya S. Kaushik ◽  
Erika Rohr ◽  
Sangjin Hyun ◽  
Stefan De Gendt ◽  
Sven Van Elshocht ◽  
...  
2008 ◽  
Vol 92 (11) ◽  
pp. 112912 ◽  
Author(s):  
James M. LeBeau ◽  
Jesse S. Jur ◽  
Daniel J. Lichtenwalner ◽  
H. Spalding Craft ◽  
Jon-Paul Maria ◽  
...  

2016 ◽  
Vol 3 (24) ◽  
pp. 1600713 ◽  
Author(s):  
Ji Hoon Park ◽  
Fwzah H. Alshammari ◽  
Zhenwei Wang ◽  
Husam N. Alshareef

2018 ◽  
Vol 924 ◽  
pp. 482-485
Author(s):  
Min Seok Kang ◽  
Kevin Lawless ◽  
Bong Mook Lee ◽  
Veena Misra

We investigated the impact of an initial lanthanum oxide (La2O3) thickness and forming gas annealing (FGA) conditions on the MOSFET performance. The FGA has been shown to dramatically improve the threshold voltage (VT) stability of 4H-SiC MOSFETs. The FGA process leads to low VTshift and high field effect mobility due to reduction of the interface states density as well as traps by passivating the dangling bonds and active traps in the Lanthanum Silicate dielectrics. By optimizing the La2O3interfacial layer thickness and FGA condition, SiC MOSFETs with high threshold voltage and high mobility while maintaining minimal VTshift are realized.


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