divergent beam
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2022 ◽  
Vol 29 (1) ◽  
Author(s):  
XianRong Huang ◽  
Xianbo Shi ◽  
Lahsen Assoufid

Rigorous dynamical theory calculations show that four-beam diffraction (4BD) can be activated only by a unique photon energy and a unique incidence direction. Thus, 4BD may be used to precisely calibrate X-ray photon energies and beam positions. Based on the principles that the forbidden-reflection 4BD pattern, which is typically an X-shaped cross, can be generated by instant imaging using the divergent beam from a point source without rocking the crystal, a detailed real-time high-resolution beam (and source) position monitoring scheme is illustrated for monitoring two-dimensional beam positions and directions of modern synchrotron light sources, X-ray free-electron lasers and nano-focused X-ray sources.


2021 ◽  
pp. 1-7
Author(s):  
Brian K. Tanner ◽  
Patrick J. McNally ◽  
Andreas N. Danilewsky

X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been shown that the tilt of the lattice planes in the Analog Devices AD9253 die initially falls, but after 100 °C, it rises again. The twist across the die wafer falls linearly with an increase in temperature. At 200 °C, the tilt varies approximately linearly with position, that is, displacement varies quadratically along the die. The warpage is approximately reversible on cooling, suggesting that it has a simple paraboloidal form prior to encapsulation; the complex tilt and twisting result from the polymer setting process. Feasibility studies are reported, which demonstrate that a divergent beam and quasi-monochromatic radiation from a sealed X-ray tube can be used to perform warpage measurements by XRDI in the laboratory. Existing tools have limitations because of the geometry of the X-ray optics, resulting in applicability only to simple warpage structures. The necessary modifications required for use in situations of complex warpage, for example, in multiple die interconnected packages are specified.


Optik ◽  
2020 ◽  
Vol 202 ◽  
pp. 163569
Author(s):  
Liping Guo ◽  
Xiaojuan Liu ◽  
Xiaolu Ge

2018 ◽  
Vol 14 (1) ◽  
Author(s):  
T. Latychevskaia ◽  
C. R. Woods ◽  
Yi Bo Wang ◽  
M. Holwill ◽  
E. Prestat ◽  
...  

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