Single Backside Cleaning on Silicon, Silicon Nitride and Silicon Oxide

In this study, we used an SEZ single-wafer spin-processor to develop a single backside cleaning solution able to remove any metallic or exotic contaminants by etching a few angstroms of the wafer backside, whatever its coating (no coating, Si3N4 or SiO2). An H2O:H2O2:H2SO4:HF mixture was selected because it allowed independent control of the etch rate on the 3 materials of interest, without roughening to much the silicon surface. Chemistry efficiency was then checked on wafers intentionally contaminated with various metals, and on “production wafers” contaminated during exotic materials deposition or classical copper processes.

Silicon Surface Chemistry By IR Spectroscopy in the Mid- To Far-IR Region: H2O And Ethanol On Si(100)

ABSTRACTThe technique of external reflection infrared (IR) spectroscopy is used to study silicon surface chemistry. External reflection is enhanced by implanting a buried cobalt silicide layer in silicon to act as an infrared reflector. The preparation of clean well-ordered surfaces from the ion implanted substrates is demonstrated. The reactions of water and ethanol with Si(100) are investigated.