thread migration
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2020 ◽  
Author(s):  
Tae Kwang Jeong ◽  
Chang Ho Chung ◽  
Kyung Hee Min

Abstract Background: The thread-lift has gained popular interest as a minimally invasive procedure because it is simple and reliable. Additionally, it has shorter recovery time and fewer complications than facelift surgery. However, complications including hematoma, infection, facial asymmetry, thread exposure, thread migration, dimpling, alopecia, parotid gland injury, and scarring can occur. We report a case of thread migration after a polydioxanone (PDO) thread lift.Case presentation: A 40-year-old woman underwent a thread lift using a PDO cogged thread. Insertion sites were marked along the temporal hairline. The expected distal ends of threads were marked at least 1.5 cm apart from the nasolabial and marionette folds and 2.5 cm apart from the mandibular border. All threads were inserted into the deep subcutaneous plane. After 1 month, she complained of a foreign body sensation and pain just lateral to the left mouth corner. She showed a linear elevation with oblique direction, and a linear material was palpated with little mobility. The removed material was confirmed to be a part of the inserted thread.Conclusion:During thread lift, it is important to remove the cannula gently and straightly to avoid breaking the thread. Also, it is better to avoid strong manual massage on the path of the thread.


Author(s):  
Quintin Fettes ◽  
Avinash Karanth ◽  
Razvan Bunescu ◽  
Ahmed Louri ◽  
Kyle Shiflett

Author(s):  
Oscar García Lorenzo ◽  
Rubén Laso Rodríguez ◽  
Tomás Fernández Pena ◽  
Jose Carlos Cabaleiro Domínguez ◽  
Francisco Fernández Rivera ◽  
...  

2019 ◽  
Vol 8 (4) ◽  
pp. 10089-10092

With the increasing levels of transistor count and clock rate of microprocessors there is a significant increase in power dissipation. Reducing power consumption in both high power consumption and high performance has developed into one of the main target in designing a system for various devices. As the chip multiprocessor (CMP) are integrating more cores on the die, it will leads to the extent of Large scale CMP (LCMP) architectures with potentially hundreds of thread on the die and thousands of cores. Therefore, we proposed an approach of OS level power optimization in LCMP to optimize the heat dissipation rate and increase computing power under some considerations. To satisfy the main goal of our work, the heat dissipation should be optimizing with increase in computing power. The approach of optimizing the heat dissipation is done at the synthesis level. There are three approaches for modifying the synthetic benchmark: Singly Synthesis, Hierarchical Synthesis and Group Synthesis. The result is that the power dissipation of Group synthesis is equally distributed without giving more loads to only one processor as compared to Hierarchical Synthesis and Singly Synthesis. Therefore, from our result we can conclude that in Group Synthesis power is equally distributed hence heat dissipation is optimized. The future work will be to further optimize the result of the Synthesis level using thread migration. Thread Migration can increase the system throughput; it relies on multiple cores that vary in performance capabilities


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