Multislice imaging of gastrointestinal stromal tumors (in french).

Les tumeurs stromales gastro-intestinales (GIST) sont les tumeurs mésenchymateuses les plus fréquentes du tube digestif. Ces tumeurs expriment le CD117 dans 95% des cas. Leur localization préférentielle est l’estomac. Leur diagnostic est difficile et parfois tardif. Le progrès de l’imagerie a largement contribué à l’amélioration de la prise en charge et donc du pronostic. La tomodensitométrie (TDM) constitue l’examen de référence pour le diagnostic, le bilan d’extension, et le suivi après traitement. La meilleure connaissance de l’histopathologie des GIST et la survie prolongée ont permis de dégager certains aspects évocateurs en imagerie. Mot clés: tumeurs stromales gastro-intestinales; tomodensitométrie; diagnostic

Multislice imaging of gastrointestinal stromal tumors

Gastrointestinal stromal tumors (GIST) are the most common mesenchymal tumors of the digestive tract (1%). These tumors express the CD 117 in 95% of cases. The stomach is the preferential localization (70%). Diagnosis is difficult and sometimes late. Progress of imaging has greatly improved the management and the prognosis. Computed tomography (CT) is the gold standard for diagnosis, staging, and treatment follow-up. The increasing recognition of GIST’s histopathology and the prolonged survival revealed some suggestive imaging aspects. Key words: gastro-intestinal stromal tumors; computed tomography; diagnosis

Multislice imaging of integrated circuits by precession X-ray ptychography

A method for nondestructively visualizing multisection nanostructures of integrated circuits by X-ray ptychography with a multislice approach is proposed. In this study, tilt-series ptychographic diffraction data sets of a two-layered circuit with a ∼1.4 µm gap at nine incident angles are collected in a wideQrange and then artifact-reduced phase images of each layer are successfully reconstructed at ∼10 nm resolution. The present method has great potential for the three-dimensional observation of flat specimens with thickness on the order of 100 µm, such as three-dimensional stacked integrated circuits based on through-silicon vias, without laborious sample preparation.