Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere

2021 ◽  
Author(s):  
Ying Meng ◽  
Yang Xu ◽  
Runhua Gao ◽  
Xinhua Wang ◽  
Xiaojuan Chen ◽  
...  
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Low Temperature Bonding ◽  
Cu Foil ◽  
Pt Catalyzed

scholarly journals Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor

Metals ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 315 ◽  
Author(s):  
Liangliang He ◽  
Junlong Li ◽  
Xin Wu ◽  
Fengwen Mu ◽  
Yinghui Wang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Material Selection ◽  
Structure Design ◽  
Acid Vapor ◽  
Higher Temperature ◽  
Cu Bonding ◽  
Bonding Method ◽  
Sintered Ag ◽  
Pt Catalyzed

With the assistance of Pt-catalyzed formic acid vapor, robust Ag-Cu bonding was realized at an ultra-low temperature of 160 °C under 3 MPa for 30 min via the sintering of Ag nanoparticles in situ generated from Ag2O microparticles. The Cu oxide layer at the interface after bonding can be eliminated, which improves the bond strength and electrical conductivity of the joint. A metallic bond contact between the sintered Ag and the Cu substrate is obtained without interfacial solid solution and intermetallic phases, and the shear strength is comparable to previous bonding at a higher temperature. The bonding mechanisms were figured out by comparing the bonding with and without the Pt-catalyzed formic acid vapor. This ultra-low temperature Ag-Cu bonding method may create more flexibilities in the structure design and material selection for power device integration.

Study of Cu Film Surface Treatment Using Formic Acid Vapor/Solution for Low Temperature Bonding

2017 ◽  
Vol 165 (4) ◽  
pp. H3080-H3084 ◽  
Author(s):  
Wenhua Yang ◽  
Yangting Lu ◽  
Chenggong Zhou ◽  
Jian Zhang ◽  
Tadatomo Suga
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Surface Treatment ◽  
Film Surface ◽  
Acid Vapor ◽  
Cu Film ◽  
Low Temperature Bonding
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