2014 International 3D Systems Integration Conference (3DIC)
Latest Publications

TOTAL DOCUMENTS

48
(FIVE YEARS 0)

H-INDEX

5
(FIVE YEARS 0)

Published By IEEE

9781479984725
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding

2014 ◽  
Author(s):  
Y. Beilliard ◽  
T. Signamarcheix ◽  
S. Moreau ◽  
L. Di Cioccio ◽  
P. Coudrain ◽  
...  
Keyword(s):  
High Density ◽  
Cu Interconnects

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges

2014 ◽  
Author(s):  
Joeri De Vos ◽  
Vladimir Cherman ◽  
Mikael Detalle ◽  
Teng Wang ◽  
Abdellah Salahouelhadj ◽  
...  
Keyword(s):  
Comparative Study

Modeling of substrate contacts in TSV-based 3D ICs

2014 ◽  
Author(s):  
Masayuki Watanabe ◽  
Masa-aki Fukase ◽  
Masashi Imai ◽  
Nanako Niioka ◽  
Tetsuya Kobayashi ◽  
...  
Keyword(s):  
3D Ics

Electroless metal deposition for IC and TSV applications

2014 ◽  
Author(s):  
James F. Rohan ◽  
Declan Casey ◽  
Monika Zygowska ◽  
Michael Moore ◽  
Brian Shanahan
Keyword(s):  
Metal Deposition

Thermal performance of 3D ICs: Analysis and alternatives

2014 ◽  
Author(s):  
Cristiano Santos ◽  
Pascal Vivet ◽  
Jean-Philippe Colonna ◽  
Perceval Coudrain ◽  
Ricardo Reis
Keyword(s):  
Thermal Performance ◽  
3D Ics
Load More ...
Sign in / Sign up

Export Citation Format

Share Document