Effect of interface on thermal conductivity of polymer composite

2005 ◽  
Author(s):  
Hai Dong ◽  
Lianhua Fan ◽  
C.P. Wong
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composite

Constructing Tanghulu-like Diamond@Silicon carbide nanowires for enhanced thermal conductivity of polymer composite

2021 ◽  
pp. 101008
Author(s):  
Yue Qin ◽  
Bo Wang ◽  
Xiao Hou ◽  
Linhong Li ◽  
Chunlong Guan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Polymer Composite ◽  
Enhanced Thermal Conductivity

Highly Thermoconductive Yet Ultraflexible Polymer Composite with Superior Mechanical Properties and Autonomous Self-Healing Functionality via Binary Fillers Strategy

2022 ◽  
Author(s):  
Dong Wang ◽  
Dingyao Liu ◽  
JianHua Xu ◽  
JiaJun Fu ◽  
Kai Wu
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Polymer Composite ◽  
High Thermal Conductivity ◽  
Thermal Dissipation ◽  
Self Healing ◽  
Formidable Challenge ◽  
Superior Mechanical Properties

It is still a formidable challenge to develop ideal thermal dissipation materials with simultaneous high thermal conductivity, excellent mechanical softness and toughness, and spontaneous self-healing. Herein, we report the introduction...

A facile method to prepare oriented boron nitride-based polymer composite with enhanced thermal conductivity and mechanical properties

2021 ◽  
pp. 101038
Author(s):  
Jing Chen ◽  
Xu Liu ◽  
Xiao Liang Zeng ◽  
Huai Yu Ye ◽  
Guo Qi Zhang
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Boron Nitride ◽  
Polymer Composite ◽  
Enhanced Thermal Conductivity

Significant Enhancement of Thermal Conductivity in Polymer Composite via Constructing Macroscopic Segregated Filler Networks

2017 ◽  
Vol 9 (34) ◽  
pp. 29071-29081 ◽  
Author(s):  
Hongju Zhou ◽  
Hua Deng ◽  
Li Zhang ◽  
Qiang Fu
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composite ◽  
Significant Enhancement

Thermal Conductivity Testing Apparatus for 3D Printed Materials

2017 ◽  
Author(s):  
Tiffaney Flaata ◽  
Gregory J. Michna ◽  
Todd Letcher
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Additive Manufacturing ◽  
3D Printing ◽  
Polymer Composite ◽  
Heat Exchangers ◽  
Fused Deposition ◽  
3D Printed ◽  
Printed Materials ◽  
Metal Polymer

Additive manufacturing, the layer-by-layer creation of parts, was initially used for rapid prototyping of new designs. Recently, due to the decrease in the cost and increase in the resolution and strength of additively manufactured parts, additive manufacturing is increasingly being used for production of parts for end-use applications. Fused Deposition Modeling (FDM), a type of 3d printing, is a process of additive manufacturing in which a molten thermoplastic material is extruded to create the desired geometry. Many potential heat transfer applications of 3d printed parts, including the development of additively manufactured heat exchangers, exist. In addition, the availability of metal/polymer composite filaments, first used for applications such as tooling for injection molding applications and to improve wear resistance, could lead to increased performance 3d printed heat exchangers because of the higher thermal conductivity of the material. However, the exploitation of 3d printing for heat transfer applications is hindered by a lack of reliable thermal conductivity data for as-printed materials, which typically include significant void fractions. In this experimental study, an apparatus to measure the effective thermal conductivity of 3d printed composite materials was designed and fabricated. Its ability to accurately measure the thermal conductivity of polymers was validated using a sample of acrylic, whose conductivity is well understood. Finally, the thermal conductivities of various 3d printed polymer, metal/polymer composite, and carbon/polymer composite filaments were measured and are reported in this paper. The materials used are acrylonitrile butadiene styrene (ABS), polylactic acid (PLA), stainless steel/PLA, Brass/PLA, and Bronze/PLA.

A new method to estimate thermal conductivity of polymer composite using characteristics of fillers

2012 ◽  
Vol 129 (3) ◽  
pp. 965-972 ◽  
Author(s):  
Hui Joon Park ◽  
Tae Ann Kim ◽  
Raehyun Kim ◽  
Junkyung Kim ◽  
Min Park
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composite ◽  
New Method
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