Thermal stress analysis and failure mechanisms for through silicon via array

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231431 ◽

2012 ◽

Author(s):

Chi-Wei Kuo ◽

Hung-Yin Tsai

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Failure Mechanisms ◽

Through Silicon Via ◽

Thermal Stress Analysis

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Thermal stress analysis and failure mechanisms for through silicon via array

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117254 ◽

2011 ◽

Author(s):

Chi-Wei Kuo ◽

Hung-Yin Tsai

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Failure Mechanisms ◽

Through Silicon Via ◽

Thermal Stress Analysis

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Thermal Stress Analysis and Design Guidelines for Through Silicon Via Structure in 3D IC Integration

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480433 ◽

2018 ◽

Author(s):

Yuanxiang Zhang ◽

Jiankun Wang ◽

Sijia Yu

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Design Guidelines ◽

3D Ic ◽

Through Silicon Via ◽

Thermal Stress Analysis ◽

Analysis And Design

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Mechanical & Thermal Stress Analysis under Actual Condition and Test Design of 550kV High Coupled Split Reactor

2020 IEEE 4th Conference on Energy Internet and Energy System Integration (EI2) ◽

10.1109/ei250167.2020.9347258 ◽

2020 ◽

Author(s):

Li Zhao ◽

Yanzhe Zhang ◽

Tong Jiang ◽

Qiang Tang ◽

Haojun Liu ◽

...

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Actual Condition ◽

Test Design ◽

Thermal Stress Analysis

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Comparative Assessment of Elastio-Viscoplastic Models for Thermal Stress Analysis of Automotive Powertrain Component

10.4271/2015-01-0533 ◽

2015 ◽

Author(s):

Jianghui Mao ◽

Carlos Engler-Pinto ◽

Xuming Su

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Comparative Assessment ◽

Thermal Stress Analysis ◽

Automotive Powertrain ◽

Viscoplastic Models

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Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6263002 ◽

2012 ◽

Author(s):

Sayuri Kohara ◽

Akihiro Horibe ◽

Kuniaki Sueoka ◽

Keiji Matsumoto ◽

Fumiaki Yamada ◽

...

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

3D Integration ◽

Thermal Stress Analysis ◽

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Thermal stress analysis for laser cutting corner with a fluctuant cutting speed in steel plate

Journal of Physics Conference Series ◽

10.1088/1742-6596/633/1/012090 ◽

2015 ◽

Vol 633 ◽

pp. 012090 ◽

Author(s):

H B Xu ◽

Jun Hu ◽

Hong Sheng ◽

Z C Du

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Laser Cutting ◽

Steel Plate ◽

Cutting Speed ◽

Thermal Stress Analysis

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Thermal stress analysis of a directionally solidified Al–1wt%Ni alloy casting

Finite Elements in Analysis and Design ◽

10.1016/j.finel.2010.06.002 ◽

2010 ◽

Vol 46 (10) ◽

pp. 889-895 ◽

Author(s):

Moisés M. Pariona ◽

Josuel K. Rugenski ◽

Manuel V. Canté ◽

José E. Spinelli ◽

Amauri Garcia

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Directionally Solidified ◽

Thermal Stress Analysis ◽

Alloy Casting ◽

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Transient Thermal Stress Analysis of a Nonhomogeneous Plate Taking into Account the Relative Heat Transfer at Boundary Surfaces.

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.62.131 ◽

1996 ◽

Vol 62 (593) ◽

pp. 131-137 ◽

Author(s):

Yoshinobu TANIGAWA ◽

Tomikazu AKAI ◽

Ryuusuke KAWAMURA ◽

Naoki OKA

Keyword(s):

Heat Transfer ◽

Thermal Stress ◽

Stress Analysis ◽

Thermal Stress Analysis ◽

Transient Thermal Stress ◽

Transient Thermal ◽

Boundary Surfaces

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Thermal stress analysis of PBGA under natural convection using a fluid-solid coupling method

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066904 ◽

2011 ◽

Author(s):

Zhimin Wan ◽

Xiaobing Luo ◽

Sheng Liu

Keyword(s):

Thermal Stress ◽

Natural Convection ◽

Stress Analysis ◽

Coupling Method ◽

Thermal Stress Analysis

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Development of Modeling of Interface Characteristics Considering Time-Dependence and Thermal Stress Analysis for Layered Concrete Structure.

Doboku Gakkai Ronbunshu ◽

10.2208/jscej.1998.585_175 ◽

1998 ◽

pp. 175-187

Author(s):

Yasuaki Ishikawa ◽

Tada-aki Tanabe

Keyword(s):

Thermal Stress ◽

Time Dependence ◽

Stress Analysis ◽

Concrete Structure ◽

Thermal Stress Analysis ◽

Interface Characteristics

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