2017 IEEE CPMT Symposium Japan (ICSJ)
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72
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4
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Published By IEEE

9781538627129
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal modeling and experimental verification using large-sized stacked chips

2017 ◽  
Author(s):  
Shunichi Kikuchi ◽  
Makoto Suwada ◽  
Yoshihisa Iwakiri ◽  
Naoaki Nakamura
Keyword(s):  
Experimental Verification ◽  
Thermal Modeling

Study of temperature estimation method for densely mounted surface mount components

2017 ◽  
Author(s):  
Yoshinori Aruga ◽  
Koichi Hirasawa ◽  
Takayuki Yamabe ◽  
Hirotoshi Aoki ◽  
Tomoyuki Hatakeyama ◽  
...  
Keyword(s):  
Estimation Method ◽  
Temperature Estimation ◽  
Surface Mount

Low-loss multi-fiber to waveguide connector for on-board applications

2017 ◽  
Author(s):  
Blanca Ruiz ◽  
Andres Ferrer ◽  
Christian Gsell ◽  
Peter Cristea
Keyword(s):  
Low Loss

Development of extremely thin profile flip chip CSP using laser assisted bonding technology

2017 ◽  
Author(s):  
ChoongHoe Kim ◽  
KwangMo Lim ◽  
JinYoung Khim ◽  
Yanggyoo Jung ◽  
MinHo Kim ◽  
...  
Keyword(s):  
Flip Chip ◽  
Thin Profile ◽  
Bonding Technology

scholarly journals Optical sensing by exposed core fiber using self-written waveguide

2017 ◽  
Author(s):  
Amalina Athira Ibrahim ◽  
Nurul Atiqah Baharudin ◽  
Osamu Mikami ◽  
Sumiaty Ambran ◽  
Fauzan Ahmad ◽  
...  
Keyword(s):  
Optical Sensing ◽  
Core Fiber
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