2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 45)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781728176437

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Stress Evaluations of Silicon Nitride Chips Bonded onto Copper Substrates via SAC Soldering, AuSn Soldering, and Copper Sintering

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420523 ◽

2020 ◽

Author(s):

Fosca Conti ◽

E Liu ◽

Sri Krishna Bhogaraju ◽

Christoph Lenz ◽

Roland Seitz ◽

...

Keyword(s):

Silicon Nitride

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Thermal Characterisation and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420519 ◽

2020 ◽

Author(s):

D. May ◽

M. Gora ◽

D. Wargulski ◽

F. Loffler ◽

M. Abo Ras ◽

...

Keyword(s):

Failure Analysis

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Real-time Ambient Temperature Estimation of Mobile Electronic Devices

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420537 ◽

2020 ◽

Author(s):

Bangjun Li ◽

Haoran Liu ◽

Ruzhu Wang

Keyword(s):

Ambient Temperature ◽

Real Time ◽

Electronic Devices ◽

Temperature Estimation

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Improving Temperature Prediction Accuracy Using Kalman and Particle Filtering Methods

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420535 ◽

2020 ◽

Author(s):

Baver Ozceylan ◽

Boudewijn R. Haverkort ◽

Maurits de Graaf ◽

Marco E. T. Gerards

Keyword(s):

Particle Filtering ◽

Prediction Accuracy ◽

Temperature Prediction

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Impact of Leakage Currents on N-MOSFET Reliability in Pulsed RF Life Test for Radar Application

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420507 ◽

2020 ◽

Author(s):

M.A. Belaid ◽

A. Almusallam

Keyword(s):

Life Test ◽

Leakage Currents ◽

Pulsed Rf

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Metal Ceramic Substrates: Enabling Heat Distribution in Power Electronic Systems

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420532 ◽

2020 ◽

Author(s):

Andre Schwobel ◽

Benjamin Fabian ◽

Miriam Rauer ◽

Daniel Schnee

Keyword(s):

Electronic Systems ◽

Heat Distribution ◽

Power Electronic ◽

Ceramic Substrates ◽

Metal Ceramic

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Study of Dynamic Simulation for Thermal-Electronic Logic Circuits

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420495 ◽

2020 ◽

Author(s):

Mahmoud Darwish ◽

Peter Neumann ◽

Janos Mizsei ◽

Laszlo Pohl

Keyword(s):

Dynamic Simulation ◽

Logic Circuits ◽

Electronic Logic

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RF Reliability of Power RF N-LDMOS Devices under Pulsed Accelerated Aging Life Test

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420499 ◽

2020 ◽

Author(s):

M.A. Belaid

Keyword(s):

Accelerated Aging ◽

Life Test

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Wind Load of Telecom Equipment in Masts – Comparing Numerical Simulations and Wind Tunnel Measurements

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420494 ◽

2020 ◽

Author(s):

Tomas W. Muld ◽

Stevin van Wyk ◽

Andreas Ankarbjork

Keyword(s):

Wind Tunnel ◽

Numerical Simulations ◽

Wind Load ◽

Wind Tunnel Measurements

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A Geometry Remodelling Approach to Heatsink Optimisation

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic49743.2020.9420530 ◽

2020 ◽

Author(s):

Robin Bornoff ◽

John Parry ◽

Matthew Sapiano ◽

Matt Warner

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2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Stress Evaluations of Silicon Nitride Chips Bonded onto Copper Substrates via SAC Soldering, AuSn Soldering, and Copper Sintering

Thermal Characterisation and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging

Real-time Ambient Temperature Estimation of Mobile Electronic Devices

Improving Temperature Prediction Accuracy Using Kalman and Particle Filtering Methods

Impact of Leakage Currents on N-MOSFET Reliability in Pulsed RF Life Test for Radar Application

Metal Ceramic Substrates: Enabling Heat Distribution in Power Electronic Systems

Study of Dynamic Simulation for Thermal-Electronic Logic Circuits

RF Reliability of Power RF N-LDMOS Devices under Pulsed Accelerated Aging Life Test

Wind Load of Telecom Equipment in Masts – Comparing Numerical Simulations and Wind Tunnel Measurements

A Geometry Remodelling Approach to Heatsink Optimisation

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications