Influence of Shot Peening on the Isothermal Fatigue Behavior of the Gamma Titanium Aluminide Ti-48Al-2Cr-2Nb at 750 °C

One possibility to improve the fatigue life and strength of metallic materials is shot peening. However, at elevated temperatures, the induced residual stresses may relax. To investigate the influence of shot peening on high-temperature fatigue behavior, isothermal fatigue tests were conducted on shot-peened and untreated samples of gamma TiAl 48-2-2 at 750 °C in air. The shot-peened material was characterized using EBSD, microhardness, and residual stress analyses. Shot peening leads to a significant increase in surface hardness and high compressive residual stresses near the surface. Both effects may have a positive influence on lifetime. However, it also leads to surface notches and tensile residual stresses in the bulk material with a negative impact on cyclic lifetime. During fully reversed uniaxial tension-compression fatigue tests (R = −1) at a stress amplitude of 260 MPa, the positive effects dominate, and the fatigue lifetime increases. At a lower stress amplitude of 230 MPa, the negative effect of internal tensile residual stresses dominates, and the lifetime decreases. Shot peening leads to a transition from surface to volume crack initiation if the surface is not damaged by the shots.

Strength and Isothermal Fatigue Resistance of Snbi/snagcu Joints Reflowed At Low Temperatures

Soldered microelectronics assemblies may have to survive a variety of mechanical loads in repeated drops, cyclic bending, or vibration. A very large body of work has addressed the isothermal fatigue performance of SnAgCu solder joints. The present work offers a general assessment of the achievable performance of so-called hybrid solder joints formed by soldering with eutectic SnBi or SnBiAg to SnAgCu bumps on area array components. This allows for soldering at much lower temperatures than with SnAgCu alone, but the deformation and damage properties of the resulting structures depend strongly on details of the design and process. A peak reflow temperature of 175C was shown to be sufficient to ensure that the life of the joints remains limited by fatigue of the unmixed SnAgCu near the component. However, a higher effective stiffness of the mixed region near the substrate means that the life will be lower by 45%.