2019 International Wafer Level Packaging Conference (IWLPC)
Latest Publications

TOTAL DOCUMENTS

46

(FIVE YEARS 46)

H-INDEX

2

(FIVE YEARS 2)

Published By IEEE

9781944543129

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Non-Destructive 3D Characterization of Application Processor Panel Level Package Used in Galaxy Smartwatch

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8914126 ◽

2019 ◽

Author(s):

Thomas Gregorich ◽

Masako Terada ◽

Cheryl Hartfield ◽

Allen Gu ◽

Jan Vardaman

Keyword(s):

Application Processor ◽

Non Destructive

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High Resolution Automatic X-Ray Inspection for Continuous Monitoring of Advanced Package Assembly

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8914113 ◽

2019 ◽

Author(s):

Scott J. Jewler

Keyword(s):

High Resolution ◽

Continuous Monitoring ◽

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[Title page]

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8914095 ◽

2019 ◽

Keyword(s):

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Process Development for Flip Chip Bonding with Different Bump Compositions

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8913986 ◽

2019 ◽

Author(s):

Samuel Massa ◽

David Shahin ◽

Ishan Wathuthanthri ◽

Annaliese Drechsler ◽

Rajneeta Basantkumar

Keyword(s):

Flip Chip ◽

Process Development ◽

Flip Chip Bonding

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Foplp Lithography Solutions to Overcome Die Placement Error, Predict Yield, Increase Throughput and Reduce Cost

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8913865 ◽

2019 ◽

Author(s):

Keith Best ◽

John Chang ◽

Mike Marshall ◽

Jian Lu

Keyword(s):

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Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8914100 ◽

2019 ◽

Author(s):

W. Hartner ◽

M. Fink ◽

G. Haubner ◽

C. Geissler ◽

J. Lodermeyer ◽

...

Keyword(s):

Wafer Level ◽

Automotive Radar ◽

And Performance

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Processing and Memory Partitioning Enabled by Low Cost Flip-Chip Stacking

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8914106 ◽

2019 ◽

Author(s):

Fabian Hopsch ◽

Andy Heinig

Keyword(s):

Flip Chip ◽

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Panel Level Packaging for Component Integration of an Energy Harvesting System

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8914021 ◽

2019 ◽

Author(s):

T. Braun ◽

K.-D. Lang ◽

R. Kahle ◽

S. Voges ◽

O. Holck ◽

...

Keyword(s):

Energy Harvesting ◽

Component Integration ◽

Energy Harvesting System

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System Co-Design Inclusive of Connectivity for 3DIC and Wafer-Level Packaging

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8913984 ◽

2019 ◽

Author(s):

TV Narayanan

Keyword(s):

Wafer Level ◽

Wafer Level Packaging

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Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8914144 ◽

2019 ◽

Author(s):

Arnita Podpod ◽

Andy Miller ◽

Gerald Beyer ◽

Eric Beyne ◽

Alice Guerrero ◽

...

Keyword(s):

Temporary Bonding ◽

Structure Assembly

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