2019 International Wafer Level Packaging Conference (IWLPC)
Latest Publications

TOTAL DOCUMENTS

46
(FIVE YEARS 0)

H-INDEX

2
(FIVE YEARS 0)

Published By IEEE

9781944543129
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Non-Destructive 3D Characterization of Application Processor Panel Level Package Used in Galaxy Smartwatch

2019 ◽  
Author(s):  
Thomas Gregorich ◽  
Masako Terada ◽  
Cheryl Hartfield ◽  
Allen Gu ◽  
Jan Vardaman
Keyword(s):  
Application Processor ◽  
Non Destructive

Process Development for Flip Chip Bonding with Different Bump Compositions

2019 ◽  
Author(s):  
Samuel Massa ◽  
David Shahin ◽  
Ishan Wathuthanthri ◽  
Annaliese Drechsler ◽  
Rajneeta Basantkumar
Keyword(s):  
Flip Chip ◽  
Process Development ◽  
Flip Chip Bonding

Panel Level Packaging for Component Integration of an Energy Harvesting System

2019 ◽  
Author(s):  
T. Braun ◽  
K.-D. Lang ◽  
R. Kahle ◽  
S. Voges ◽  
O. Holck ◽  
...  
Keyword(s):  
Energy Harvesting ◽  
Component Integration ◽  
Energy Harvesting System

Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift

2019 ◽  
Author(s):  
Arnita Podpod ◽  
Andy Miller ◽  
Gerald Beyer ◽  
Eric Beyne ◽  
Alice Guerrero ◽  
...  
Keyword(s):  
Temporary Bonding ◽  
Structure Assembly

Improved Semiconductor Device Reliability from Plasma Dicing

2019 ◽  
Author(s):  
R. Barnett ◽  
Janet Hopkins ◽  
Stewart Fulton ◽  
Oliver Ansell ◽  
Samira Kazemi ◽  
...  
Keyword(s):  
Semiconductor Device ◽  
Device Reliability ◽  
Semiconductor Device Reliability

The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films

2019 ◽  
Author(s):  
Tobias Bernhard ◽  
Sebastian Zarwell ◽  
Edith Steinhauser ◽  
Stefan Kempa ◽  
Frank Bruning
Keyword(s):  
Void Formation ◽  
Growth Mode ◽  
Cu Films

An Overview About the Excimer Laser Ablation of Different Polymers and Their Application for Wafer and Panel Level Packaging

2019 ◽  
Author(s):  
Robert Gernhardt ◽  
Markus Wohrmann ◽  
Friedrich Muller ◽  
Karin Hauck ◽  
Michael Topper ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Excimer Laser Ablation
Load More ...
Sign in / Sign up

Export Citation Format

Share Document