2019 International Wafer Level Packaging Conference (IWLPC)
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9781944543129
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Process Development for Flip Chip Bonding with Different Bump Compositions

2019 ◽  
Author(s):  
Samuel Massa ◽  
David Shahin ◽  
Ishan Wathuthanthri ◽  
Annaliese Drechsler ◽  
Rajneeta Basantkumar
Keyword(s):  
Flip Chip ◽  
Process Development ◽  
Flip Chip Bonding

Improved Semiconductor Device Reliability from Plasma Dicing

2019 ◽  
Author(s):  
R. Barnett ◽  
Janet Hopkins ◽  
Stewart Fulton ◽  
Oliver Ansell ◽  
Samira Kazemi ◽  
...  
Keyword(s):  
Semiconductor Device ◽  
Device Reliability ◽  
Semiconductor Device Reliability

The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films

2019 ◽  
Author(s):  
Tobias Bernhard ◽  
Sebastian Zarwell ◽  
Edith Steinhauser ◽  
Stefan Kempa ◽  
Frank Bruning
Keyword(s):  
Void Formation ◽  
Growth Mode ◽  
Cu Films

An Overview About the Excimer Laser Ablation of Different Polymers and Their Application for Wafer and Panel Level Packaging

2019 ◽  
Author(s):  
Robert Gernhardt ◽  
Markus Wohrmann ◽  
Friedrich Muller ◽  
Karin Hauck ◽  
Michael Topper ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Excimer Laser Ablation
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