Process Development for Flip Chip Bonding with Different Bump Compositions

2019 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2019.8913986 ◽

2019 ◽

Author(s):

Samuel Massa ◽

David Shahin ◽

Ishan Wathuthanthri ◽

Annaliese Drechsler ◽

Rajneeta Basantkumar

Keyword(s):

Flip Chip ◽

Process Development ◽

Flip Chip Bonding

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Process Development of micro-bump flip chip bonding with Non-Conductive Film

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654388 ◽

2018 ◽

Author(s):

Ser Choong Chong ◽

Hongyu Li ◽

Daniel Ismael Cereno ◽

Ling Xie

Keyword(s):

Flip Chip ◽

Process Development ◽

Flip Chip Bonding ◽

Conductive Film

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Improvement of light extraction for AlGaN-based near UV LEDs with flip-chip bonding fabricated on grooved sapphire substrate using laser ablation

Materials Science in Semiconductor Processing ◽

10.1016/j.mssp.2019.02.011 ◽

2019 ◽

Vol 95 ◽

pp. 48-53

Author(s):

Chun-Han Ku ◽

Wei-Kai Wang ◽

Ray-Hua Horng

Keyword(s):

Laser Ablation ◽

Sapphire Substrate ◽

Flip Chip ◽

Light Extraction ◽

Flip Chip Bonding ◽

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Maskless Fabrication for Micropad Interconnection using Electroless NiB Deposition and Application to "Chemical" Flip-Chip Bonding

ECS Meeting Abstracts ◽

10.1149/ma2008-02/38/2521 ◽

2008 ◽

Keyword(s):

Flip Chip ◽

Flip Chip Bonding

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Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS

10.1117/12.453687 ◽

2002 ◽

Author(s):

Ronald E. Reedy ◽

Hal Anthony ◽

Charles Kuznia ◽

Mike Pendelton ◽

Jim Cable ◽

...

Keyword(s):

Low Power ◽

Flip Chip ◽

Optoelectronic Devices ◽

Fully Integrated ◽

Flip Chip Bonding

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FE Modeling and Analysis on Thermosonic Flip Chip Bonding Process for Cu/low-k Wafer

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480686 ◽

2018 ◽

Author(s):

Xuezhi Zhang ◽

Jian Gao ◽

Yun Chen ◽

Yunbo He ◽

Xin Chen

Keyword(s):

Flip Chip ◽

Bonding Process ◽

Fe Modeling ◽

Modeling And Analysis ◽

Flip Chip Bonding ◽

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Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670786 ◽

2002 ◽

Author(s):

M. Itagaki ◽

K. Amami ◽

Y. Tomura ◽

S. Yuhaku ◽

O. Noda ◽

...

Keyword(s):

Flip Chip ◽

Flip Chip Bonding ◽

Bonding Technology

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Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

2015 IEEE Optical Interconnects Conference (OI) ◽

10.1109/oic.2015.7115716 ◽

2015 ◽

Author(s):

Yun Wang ◽

Stevan S. Djordjecvic ◽

Jin Yao ◽

John E. Cunningham ◽

Xuezhe Zheng ◽

...

Keyword(s):

Silicon Photonics ◽

Flip Chip ◽

Cavity Surface ◽

Flip Chip Bonding ◽

Vertical Cavity Surface ◽

Surface Emitting Laser ◽

Vertical Cavity

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A S-band 3D Surface Mount Packaged SiGe and GaN Tx Module Using Flip-Chip Bonding and a Device Embedded PCB Substrate

2018 13th European Microwave Integrated Circuits Conference (EuMIC) ◽

10.23919/eumic.2018.8539907 ◽

2018 ◽

Author(s):

Kengo Kawasaki ◽

Eigo Kuwata ◽

Hidenori Ishibashi ◽

Tomohiro Yao ◽

Kiyoshi Ishida ◽

...

Keyword(s):

Flip Chip ◽

Surface Mount ◽

Flip Chip Bonding ◽

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Fluxless Flip-Chip Bonding Process Using Hydrogen Radical

2008 10th Electronics Packaging Technology Conference ◽

10.1109/eptc.2008.4763498 ◽

2008 ◽

Author(s):

Taizo Hagihara ◽

Tatsuya Takeuchi ◽

Yasuhide Ohno

Keyword(s):

Flip Chip ◽

Bonding Process ◽

Flip Chip Bonding ◽

Hydrogen Radical

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High-speed electroabsorption (EA) modulator modules using the flip-chip bonding (FCB) technique

OFC 2001. Optical Fiber Communication Conference and Exhibit. Technical Digest Postconference Edition (IEEE Cat. 01CH37171) ◽

10.1109/ofc.2001.928517 ◽

2002 ◽

Author(s):

T. Miyahara ◽

S. Kaneko ◽

M. Noda ◽

M. Ishizaki ◽

Y. Kitamura ◽

...

Keyword(s):

Flip Chip ◽

Flip Chip Bonding

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