Abstract
We have developed a new temporary bonding film (TBF) and new debonding system with Xe flash light irradiation, named photonic release system, for advanced package assembly process. Since new TBF has a high Tg over 200 °C after curing and shows good chemical resistance to developer, resist stripper, and plating chemicals, no delamination, voiding, and swelling were observed after thermal and chemical treatment in the bonded structure of wafer and glass carrier. In addition, by adopting a metal-sputtered glass carrier, wafer could be debonded by Xe flash light irradiation in less than 1 ms through the glass carrier with no damage. Residual TBF on the wafer surface could be peeled off smoothly at ambient temperature without residue on the wafer. In this research, we also demonstrated the good applicability of this temporary bonding film to the typical packaging process by using test vehicle including 12 inch mold wafer and the advantage of photonic release system.
Wnt/β‐catenin signaling: Structure, assembly and endocytosis of the signalosome
