2021 44th International Spring Seminar on Electronics Technology (ISSE)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 81)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781665414777

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Reliability of Embedded SMD Resistors Realized by Face–down Technology

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467671 ◽

2021 ◽

Author(s):

Tomas Lenger ◽

Alena Pietrikova ◽

Lubomir Livovsky

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Early-Stage Control of Oxygen Sensors for ICE Engines Using Digital Adaptive Filtering

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467513 ◽

2021 ◽

Author(s):

Lucian Andrei Perisoara ◽

Irina Bristena Bacis

Keyword(s):

Adaptive Filtering ◽

Early Stage ◽

Oxygen Sensors

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Comparison between Resistive and Inductive Textile Sensors for Upper Limbs Edema Measurement

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467589 ◽

2021 ◽

Author(s):

Katerina Mouckova ◽

Stanislav Suchy ◽

Daniela Moravcova ◽

Radek Soukup

Keyword(s):

Upper Limbs ◽

Textile Sensors

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Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467626 ◽

2021 ◽

Author(s):

Josef Skacel ◽

Alexandr Otahal ◽

Martin Buran ◽

Ivan Szendiuch

Keyword(s):

Sample Preparation

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Chip and Board Scale Transient Thermal Simulations for Power MOS Devices Reliability Analysis

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467624 ◽

2021 ◽

Author(s):

Madalin Vasile Moise ◽

Paul Svasta ◽

Norocel Codreanu ◽

Ciprian Ionescu ◽

Mihaela Pantazica ◽

...

Keyword(s):

Reliability Analysis ◽

Mos Devices ◽

Transient Thermal ◽

Thermal Simulations

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Temperature Dependent Relaxation Behavior of Pressureless and Pressure Assisted Sintered Silver

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467547 ◽

2021 ◽

Author(s):

Zeynep Gokce Gokdeniz ◽

Martin Lederer ◽

Golta Khatibi ◽

Johann Nicolics

Keyword(s):

Relaxation Behavior ◽

Temperature Dependent ◽

Sintered Silver

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Integrated Platform for Remote Investigation of Passive Components and Circuits Parameters

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467567 ◽

2021 ◽

Author(s):

V.M. Moise ◽

M. Otoiu ◽

P.M. Svasta

Keyword(s):

Passive Components ◽

Integrated Platform

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Conformable Electronics: Thermoforming and Injection Molding of Electronic Components

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467588 ◽

2021 ◽

Author(s):

Julian Schirmer ◽

Marcus Reichenberger ◽

Simone Neermann ◽

Jorg Franke

Keyword(s):

Injection Molding ◽

Electronic Components

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Characterization of Crimp Interconnections for Hybrid Integration of Screen-Printed Electronics

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467558 ◽

2021 ◽

Author(s):

Michael Huemmer ◽

Julian Schirmer ◽

Matthias Klauss ◽

Marcus Reichenberger

Keyword(s):

Printed Electronics ◽

Hybrid Integration ◽

Screen Printed

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Investigation of π Stacking Functionalization of Carbon Allotropes for RH Sensing

2021 44th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse51996.2021.9467585 ◽

2021 ◽

Author(s):

Karel Sima ◽

Jiri Stulik ◽

Josef Slauf ◽

Tomas Blecha ◽

Ales Hamacek

Keyword(s):

Carbon Allotropes ◽

Π Stacking

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2021 44th International Spring Seminar on Electronics Technology (ISSE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Reliability of Embedded SMD Resistors Realized by Face–down Technology

Early-Stage Control of Oxygen Sensors for ICE Engines Using Digital Adaptive Filtering

Comparison between Resistive and Inductive Textile Sensors for Upper Limbs Edema Measurement

Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

Chip and Board Scale Transient Thermal Simulations for Power MOS Devices Reliability Analysis

Temperature Dependent Relaxation Behavior of Pressureless and Pressure Assisted Sintered Silver

Integrated Platform for Remote Investigation of Passive Components and Circuits Parameters

Conformable Electronics: Thermoforming and Injection Molding of Electronic Components

Characterization of Crimp Interconnections for Hybrid Integration of Screen-Printed Electronics

Investigation of π Stacking Functionalization of Carbon Allotropes for RH Sensing

2021 44th International Spring Seminar on Electronics Technology (ISSE)
Latest Publications