Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

1424404886

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Newly developed LCP solvent casting film and its applications

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707589 ◽

2006 ◽

Author(s):

S. Okamoto

Keyword(s):

Solvent Casting

Nanopackaging: nanotechnologies and electronics packaging

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707593 ◽

2006 ◽

Cited By ~ 1

Author(s):

J.E. Morris

Keyword(s):

Electronics Packaging

Laser soldering system calibration based on computer vision

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707572 ◽

2006 ◽

Author(s):

Xinjue Zou ◽

Zhenhua Xiong ◽

Yulin Wang ◽

Han Ding

Keyword(s):

Computer Vision ◽

System Calibration ◽

Laser Soldering

Experimental studies on bonding pressure in wire bonding

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707578 ◽

2006 ◽

Author(s):

Rongzhi Gao ◽

Lei Han ◽

Jue Zhong

Keyword(s):

Experimental Studies ◽

Wire Bonding ◽

Bonding Pressure

Effect of bonding pressure on transducer ultrasonic propagation in thermosonic flip chip bonding

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707579 ◽

2006 ◽

Author(s):

Long Zhili ◽

Han Lei ◽

Wu Yunxin ◽

Zhong Jue

Keyword(s):

Flip Chip ◽

Bonding Pressure ◽

Flip Chip Bonding ◽

Ultrasonic Propagation

Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707575 ◽

2006 ◽

Author(s):

Dezhi Li ◽

Changqing Liu ◽

P.P. Conway

Keyword(s):

Flip Chip ◽

Solder Joints ◽

Fine Pitch

Integration of a 5-GHz radio front-end in PCB

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707582 ◽

2006 ◽

Author(s):

Shaofang Gong ◽

A. Backstrom ◽

M. Agesjo ◽

A. Serban ◽

M. Karlsson

Keyword(s):

Front End ◽

5 Ghz

Low cost smart labels assembled by anisotropically conductive adhesive

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707597 ◽

2006 ◽

Cited By ~ 3

Author(s):

An Bing ◽

Chu Hua-bin ◽

He Jing-qiang ◽

Wang Jia ◽

Hua Li ◽

...

Keyword(s):

Low Cost ◽

Conductive Adhesive

Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707571 ◽

2006 ◽

Author(s):

Fuliang Wang ◽

Junhui Li ◽

Lei Han ◽

Jue Zhong

Keyword(s):

Flip Chip ◽

Bonding Parameters ◽

Flip Chip Bonding

Experimental research on compulsive cooling of swirling jet impingement

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707580 ◽

2006 ◽

Cited By ~ 1

Author(s):

Yifeng Fu ◽

Jiemin Zhou ◽

Ying Yang

Keyword(s):

Experimental Research ◽

Jet Impingement ◽

Swirling Jet

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Newly developed LCP solvent casting film and its applications

Nanopackaging: nanotechnologies and electronics packaging

Laser soldering system calibration based on computer vision

Experimental studies on bonding pressure in wire bonding

Effect of bonding pressure on transducer ultrasonic propagation in thermosonic flip chip bonding

Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads

Integration of a 5-GHz radio front-end in PCB

Low cost smart labels assembled by anisotropically conductive adhesive

Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern

Experimental research on compulsive cooling of swirling jet impingement

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.
Latest Publications