Humidity influence on mechanics of paper materials: joint numerical and experimental study on fiber and fiber network scale

Paper materials are well-known to be hydrophilic unless chemical and mechanical processing treatments are undertaken. The relative humidity impacts the fiber elasticity, the interfiber joint behavior and the failure mechanism. In this work, we present a comprehensive experimental and computational study on mechanical properties of the fiber and the fiber network under humidity influence. The manually extracted cellulose fiber is exposed to different levels of humidity, and then mechanically characterized using atomic force microscopy, which delivers the humidity dependent longitudinal Young’s modulus. We describe the relation and calibrate the data into an exponential function, and the obtained relationship allows calculation of fiber elastic modulus at any humidity level. Moreover, by using confoncal laser scanning microscopy, the coefficient of hygroscopic expansion of the fibers is determined. We further present a finite element model to simulate the deformation and the failure of the fiber network. The model includes the fiber anisotropy and the hygroscopic expansion using the experimentally determined constants, and further considers interfiber behavior and debonding by using a humidity dependent cohesive zone interface model. Simulations on exemplary fiber network samples are performed to demonstrate the influence of different aspects including relative humidity and fiber-fiber bonding parameters on the mechanical features, such as force-elongation curve, strength and extensibility. Finally, we provide computational insights for interfiber bond damage pattern with respect to different humidity level as further outlook.

Experimental investigation on adhesive bonding of similar and dissimilar weld joint used for automotive applications

The automobile industry has started using adhesive bonding to join load bearing components which aerospace industry has been using for decades. Adhesive lap joints are used frequently in the manufacture of automobile. In present study, structural adhesives were used to join the aluminium alloy (AA5083 H111) with the HSS dual phase (DP780) steel. Adhesive bonding appears to be one of the appropriate methods of joining dissimilar materials. The aim of this work is to analyze the tensile strength of similar and dissimilar joints. The influence of various parameters was also investigated such as the overlap length and the bondline thickness of specimens. In DP steel, there is 22% increase in strength for similar lap joint when overlap length changes from 10 mm to 15 mm, while there is 45% increase in strength when it varies from 15 mm to 20 mm. Similarly in case of Al alloy, there is 26% increased strength for similar lap joints when length varies from 10 mm to 15 mm, while it increased to 42% when length changes from 15 mm to 25 mm and there is about 35% increase in strength for length varies from 20 mm to 25 mm. In case of dissimilar joints, firstly there is about 16% increase in strength then there is 5% decrease while after that there is 45% increase in strength. Adhesion failure, cohesion failure and mixed failure were obtained experimentally during failure mode analysis. As the strength of joint increases, failure mode shows a transition from adhesion failure to cohesion failure. From the literature survey it is evident that limited work has been carried out on analysis of shear-tensile strength of adhesively bonded steel and aluminium joint with variation in bonding parameters. Not much work on failure mode analysis of bonded joints during tensile testing has been reported. In present work a noval attempt has been made to analyze the shear-tensile strength and failure mode of adhesively bonded steel and aluminium joint with variation in bonding parameters.

Lithium aluminosilicate glass-ceramics for low-temperature anodic sealing of MEMS sensors

The results of a study of the anodic bonding parameters of transparent glass-ceramics based on lithium aluminosilicates which are promising as structural materials of MEMS and MOEMS sensors are presented. A comparison of the optical transmittance of these materials and classical for MEMS industry glasses has been carried out. The glass-ceramics electrical conductivity in a wide temperature range has been measured. The procedure of hermetic sealing of glass-ceramics by the anodic bonding at temperatures of 150 – 250 °C has been worked out. A prototype of glass-ceramic atomic cell has been fabricated.

Interfacial Behavior and Shear Strength of Al-25Si-4Cu-1Mg Joints by Transient Liquid Phase Bonding with Cu as Interlayer

Spray-formed hypereutectic Al-Si-Cu-Mg alloy is the candidate for automotive and aerospace industries due to its superior wear resistance, lower thermal expansion coefficient and density, and higher thermal conductivity. This paper aims to investigate the bonding properties of hypereutectic Al-25Si-4Cu-1Mg alloys using the transient liquid phase (TLP) method with Cu as an interlayer. To obtain the suitable bonding parameters, the interfacial microstructure and shear strength of Al-25Si-4Cu-1Mg joints were investigated with the effect of different bonding temperatures and holding times. The results showed that TLP bonding between Al-Si-Mg-Cu alloy was mainly realized by large amounts of Al2Cu intermetallic compounds (IMCs), primary Si and α-Al phases. With the brazing temperature increasing, the width of the brazing seam gradually increased, and the voids began to be produced. With the holding time increasing, θ-Al2Cu phases approached into the base metal and Si particles in the brazing seam were obviously coarsened. With the formation of θ-Al2Cu phases into the base metal, more Si particles were segregated at the interface between brazing seam and base metal, and the shear test confirmed that it was the weakest bonding location. Finally, the effect of bonding parameters on the joint strength indicated that the joint brazed at 540 °C for 7.5 min presented the best shear performance with the shear strength reaching 75 MPa because the size of Si particles in the brazing seam was closest to the size of Si particles in base metal under this parameter.

Bending strength of ceramic compounds bonded with silicate-based glass solder

In the field of dental technology, the length of ceramic pontics is limited to avoid mechanical failure. To reduce thermal-induced residual stress within the ceramic, using smaller subcomponents and subsequent bonding with silicate-based glass solder may be a favorable approach. Thus, the bending strength of zirconia compounds bonded with different silicate-based glass solders was investigated. For this purpose, rectangular specimens made of zirconia were bonded by glass solder. Parameters such as the scarf angle (45° and 90°), two different glass solders, as well as the soldering process (pressure and surface treatment) were varied. All specimens were subjected to quasi-static four-point bending tests according to DIN EN ISO 843-1. Additionally, the quality of the glass solder connection was evaluated using μCT and fractography. In the present study, zirconia compounds were sucessful bonded of zirconia compounds using silicate-based glass solder was. No significant differences in terms of bending strength were observed with respect to the different bonding parameters analyzed. The highest bending strength of 130.6 ± 50.5 MPa was achieved with a 90° scarf angle combined with ethanol treatment of the specimens before soldering and an additional application of a pressure of 2 bars in a dental pressure pot before subsequent soldering. Nevertheless, the bending strengths were highly decreased when compared to monolithic zirconia specimens (993.4 ± 125.5 MPa).

Microstructure and Mechanical Properties of Vacuum Diffusion Bonded Ti2AlNb/Ti/TC4 Joint

In this paper, the Ti2AlNb alloy was bonded to TC4 alloy using the vacuum diffusion bonding method with a Ti interlayer. The interfacial microstructure of the Ti2AlNb/Ti/TC4 joint was characterized. The relationship between the bonding parameters and the microstructure and mechanical property of the joints was explored. Results indicated that the interdiffusion of Nb and Al elements between the interlayer and substrates promoted the formation of the lamellar α + β dual-phase structure in the joint. The bonding parameters determined the diffusion distance of Nb and Al elements, thus controlling the characteristics of the lamellar α + β dual-phase structure. When the Ti2AlNb alloy and TC4 alloy were bonded at 950 °C for 30 min under a pressure of 10 MPa, the elemental diffusion in the bonding couple was sufficient and the joint possessed the maximum shear strength of 549 MPa.

Thermoplastic Elastomer (TPE)–Poly(Methyl Methacrylate) (PMMA) Hybrid Devices for Active Pumping PDMS-Free Organ-on-a-Chip Systems

Polydimethylsiloxane (PDMS) has been used in microfluidic systems for years, as it can be easily structured and its flexibility makes it easy to integrate actuators including pneumatic pumps. In addition, the good optical properties of the material are well suited for analytical systems. In addition to its positive aspects, PDMS is well known to adsorb small molecules, which limits its usability when it comes to drug testing, e.g., in organ-on-a-chip (OoC) systems. Therefore, alternatives to PDMS are in high demand. In this study, we use thermoplastic elastomer (TPE) films thermally bonded to laser-cut poly(methyl methacrylate) (PMMA) sheets to build up multilayered microfluidic devices with integrated pneumatic micro-pumps. We present a low-cost manufacturing technology based on a conventional CO2 laser cutter for structuring, a spin-coating process for TPE film fabrication, and a thermal bonding process using a pneumatic hot-press. UV treatment with an Excimer lamp prior to bonding drastically improves the bonding process. Optimized bonding parameters were characterized by measuring the burst load upon applying pressure and via profilometer-based measurement of channel deformation. Next, flow and long-term stability of the chip layout were measured using microparticle Image Velocimetry (uPIV). Finally, human endothelial cells were seeded in the microchannels to check biocompatibility and flow-directed cell alignment. The presented device is compatible with a real-time live-cell analysis system.

A Heuristic for Designing Hybrid Compact Heat Exchangers for Nuclear Applications

Hybrid compact heat exchangers (HCHEs) are a potential source of innovation for intermediate heat exchangers in nuclear industry, with HCHEs being designed for Gen-IV nuclear power applications. Compact heat exchangers are commonly fabricated using diffusion bonding, which can provide challenges for HCHEs due to resultant non-uniform stress distributions across hybrid structures during bonding, leading to variations in joint properties that can compromise performance and safety. In this paper, we introduce and evaluate a heuristic for determining whether a feasible set of diffusion bonding conditions exist for producing HCHE designs capable of meeting regulatory requirements under nuclear boiler and pressure vessel codes. A diffusion bonding model for predicting pore elimination and structural analyses are used to inform the heuristic and a heat exchanger design for 316 stainless steel is used to evaluate the efficacy of the heuristic to develop acceptable diffusion bonding parameters. A set of diffusion bonding conditions were identified and validated experimentally by producing various test coupons for evaluating bond strength, ductility, porosity, grain size, creep rupture, creep fatigue and channel deviation. A five-layer hybrid compact heat exchanger structure was fabricated and tensile tested demonstrating that the bonding parameters satisfy all criteria in this paper for diffusion bonding HCHEs with application to the nuclear industry.