4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004.

A general weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402760 ◽

2005 ◽

Author(s):

Johao Liu ◽

Liqiang Cao ◽

Min Xie ◽

Thong-Ngee Goh ◽

Yong Tang

Keyword(s):

Reliability Analysis ◽

Weibull Model ◽

Failure Criteria ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Joining Technology

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Anisotropic effect when using isotropic conductive adhesives

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402736 ◽

2005 ◽

Author(s):

J. Felba ◽

A. Moscicki ◽

M. Bereski

Keyword(s):

Conductive Adhesives ◽

Anisotropic Effect ◽

Isotropic Conductive Adhesives

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Layer-by-layer nanoarchitecture of ultrathin films assembled of PEDOT-PSS and PPy to act as hole transport layer in polymer light emitting diodes and polymer transistors

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402766 ◽

2005 ◽

Author(s):

R.K. Khillan ◽

R. Ghan ◽

R. Dasaka ◽

Y. Su ◽

L. Lvov ◽

...

Keyword(s):

Ultrathin Films ◽

Light Emitting Diodes ◽

Hole Transport ◽

Transport Layer ◽

Hole Transport Layer ◽

Layer By Layer ◽

Light Emitting ◽

Polymer Light Emitting Diodes

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Utilization of laser technologies in the preparation of the physical structure of a miniature electrochemical cell used for biosensor researches

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402771 ◽

2005 ◽

Cited By ~ 1

Author(s):

H. Santha ◽

R. Berenyi ◽

B. Balogh ◽

G. Harsanyi

Keyword(s):

Electrochemical Cell ◽

Physical Structure ◽

Laser Technologies

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Characterizing adhesives for optoelectronics

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402764 ◽

2005 ◽

Author(s):

R.A. Pearson ◽

G. Connelly

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Growth process control of pentacene thin films and its application in full organic thin film transistors

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402765 ◽

2005 ◽

Author(s):

U. Haa ◽

A. Haase ◽

H. Maresch ◽

B. Stadlober ◽

G. Leising

Keyword(s):

Thin Film ◽

Thin Films ◽

Process Control ◽

Thin Film Transistors ◽

Growth Process ◽

Organic Thin Film Transistors ◽

Organic Thin Film

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Thermal deformations and stresses of flip chip bga packages with low- and high-T/sub g/ underfills

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402757 ◽

2005 ◽

Author(s):

M.Y. Tsai ◽

Y.C. Lin ◽

J.D. Wu

Keyword(s):

Flip Chip ◽

Thermal Deformations ◽

Bga Packages

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Eco-fabrications and applications of noble metal nano-particles by ultrasound

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402740 ◽

2005 ◽

Author(s):

Y. Hayashi ◽

M. Inoue ◽

K. Niihara ◽

K. Suganuma

Keyword(s):

Noble Metal ◽

Nano Particles ◽

Metal Nano Particles

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Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402752 ◽

2005 ◽

Author(s):

G. Don ◽

D.C. Whalley ◽

Changqing Liu

Keyword(s):

Electrical Conduction ◽

Solid Metal ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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On hydro-thermal stresses of plastic IC packages

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402744 ◽

2005 ◽

Author(s):

Fei Su ◽

Kerm Sin Chian ◽

Sang Yi

Keyword(s):

Thermal Stresses

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4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004.
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A general weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology

Anisotropic effect when using isotropic conductive adhesives

Layer-by-layer nanoarchitecture of ultrathin films assembled of PEDOT-PSS and PPy to act as hole transport layer in polymer light emitting diodes and polymer transistors

Utilization of laser technologies in the preparation of the physical structure of a miniature electrochemical cell used for biosensor researches

Characterizing adhesives for optoelectronics

Growth process control of pentacene thin films and its application in full organic thin film transistors

Thermal deformations and stresses of flip chip bga packages with low- and high-T/sub g/ underfills

Eco-fabrications and applications of noble metal nano-particles by ultrasound

Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles

On hydro-thermal stresses of plastic IC packages

Export Citation Format

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A general weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology

Anisotropic effect when using isotropic conductive adhesives

Layer-by-layer nanoarchitecture of ultrathin films assembled of PEDOT-PSS and PPy to act as hole transport layer in polymer light emitting diodes and polymer transistors

Utilization of laser technologies in the preparation of the physical structure of a miniature electrochemical cell used for biosensor researches

Characterizing adhesives for optoelectronics

Growth process control of pentacene thin films and its application in full organic thin film transistors

Thermal deformations and stresses of flip chip bga packages with low- and high-T/sub g/ underfills

Eco-fabrications and applications of noble metal nano-particles by ultrasound

Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles

On hydro-thermal stresses of plastic IC packages

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004.
Latest Publications