2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
Latest Publications

TOTAL DOCUMENTS

194

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Published By IEEE

9781424439119

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Electrothermal transport in carbon nanofiber interconnects

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232679 ◽

2009 ◽

Author(s):

Toshishige Yamada ◽

Tsutomu Saito ◽

Drazen Fabris ◽

Cary Y. Yang

Keyword(s):

Carbon Nanofiber ◽

Electrothermal Transport

The impact on electric characteristics of solar modules by its internal defects

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232550 ◽

2009 ◽

Cited By ~ 1

Author(s):

Wang Yongqing ◽

Cai Ailing ◽

Sun Rongxia ◽

Guo Yukun

Keyword(s):

Internal Defects ◽

The Impact

A novel Negative Bias Temperature Instability model for nanoscale Finfet

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232688 ◽

2009 ◽

Author(s):

Chenyue Ma ◽

Bo Li ◽

Frank He ◽

Xing Zhang ◽

Xinnan Lin

Keyword(s):

Negative Bias ◽

Negative Bias Temperature Instability ◽

Temperature Instability ◽

Bias Temperature Instability

An on-chip monitor for measuring NBTI degradation of digital circuits

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232605 ◽

2009 ◽

Cited By ~ 3

Author(s):

Zheng-yu Zhong ◽

Min Cai ◽

Qun-yong Wang ◽

Na Li

Keyword(s):

Digital Circuits ◽

On Chip

New approach: Sample preparation methodology for P-V metal void inspection

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232571 ◽

2009 ◽

Author(s):

Po Fu Chou ◽

Ru Yu Lin ◽

Tung-Hung Chen

Keyword(s):

Sample Preparation ◽

New Approach

The effect of polyimide surface treatment on flip-chip assembly

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232691 ◽

2009 ◽

Cited By ~ 1

Author(s):

M.C. Ong ◽

X.L. Zhao ◽

S.H. Lim ◽

J.M. Chin ◽

Chia-Ken Leong ◽

...

Keyword(s):

Surface Treatment ◽

Flip Chip ◽

Flip Chip Assembly

Current topics on PV module and system reliability

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232564 ◽

2009 ◽

Author(s):

Liang Ji

Keyword(s):

System Reliability ◽

Pv Module

THB reliability research for fine pitch substrate

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232666 ◽

2009 ◽

Author(s):

Weiwei Feng ◽

Jianwei Zhou ◽

Xingming Fu ◽

Qian Wang ◽

Jaisung Lee

Keyword(s):

Fine Pitch

Physical and structural properties of HfO2/SiO2 gate stack high-k dielectrics deposited by atomic layer deposition

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232575 ◽

2009 ◽

Author(s):

Zhou Tao ◽

Liu Hongxia ◽

Kuang Qianwei ◽

Cai Naiqiong ◽

Hao Yue ◽

...

Keyword(s):

Atomic Layer Deposition ◽

Structural Properties ◽

Atomic Layer ◽

Gate Stack ◽

Layer Deposition ◽

High K

Investigation of engineering fallout caused by package design marginality

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232627 ◽

2009 ◽

Author(s):

L.L. Goh ◽

C.N. Liew

Keyword(s):

Package Design

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated CircuitsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Electrothermal transport in carbon nanofiber interconnects

The impact on electric characteristics of solar modules by its internal defects

A novel Negative Bias Temperature Instability model for nanoscale Finfet

An on-chip monitor for measuring NBTI degradation of digital circuits

New approach: Sample preparation methodology for P-V metal void inspection

The effect of polyimide surface treatment on flip-chip assembly

Current topics on PV module and system reliability

THB reliability research for fine pitch substrate

Physical and structural properties of HfO2/SiO2 gate stack high-k dielectrics deposited by atomic layer deposition

Investigation of engineering fallout caused by package design marginality

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
Latest Publications