scholarly journals Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates

2020 ◽  
Author(s):  
Chuantong Chen ◽  
Zheng Zhang ◽  
Katsuaki Suganuma
Keyword(s):  
High Temperature ◽  
Ag Particles ◽  
Micron Size

Bimetallic Supported Pd-Ag Catalysts

2015 ◽  
Vol 1085 ◽  
pp. 205-208
Author(s):  
Ivan S. Bondarchuk ◽  
Grigory V. Mamontov ◽  
Francisco J. Cadete Santos Aires ◽  
Irina A. Kurzina
Keyword(s):  
High Temperature ◽  
Strong Interaction ◽  
Simultaneous Reduction ◽  
Ag Particles ◽  
Supported Pd ◽  
Ag Catalysts

Series of Pd-Ag/SiO2, Pd/CeO2 and Pd-Ag/CeO2 catalysts with different Pd/Ag ration were synthesized and investigated. It was shown that simultaneous reduction of Pd and Ag took place for Pd-Ag/SiO2 and Pd Ag/CeO2 catalysts during TPR-H2. That may be associated with formation of bimetallic Pd-Ag particles. The high temperature of Pd reduction was observed for Pd/CeO2 and Pd-Ag/CeO2 catalysts. That was associated with strong interaction of PdO with CeO2 or formation of mixed PdxCeO2-δ phase.

Evaluation of Exothermic Reactions in Cofired Platinum /Alumina Microsystems

2012 ◽  
Vol 2012 (1) ◽  
pp. 000622-000627
Author(s):  
Ali Karbasi ◽  
W. Kinzy Jones
Keyword(s):  
High Temperature ◽  
Melting Point ◽  
Particle Morphology ◽  
Alumina Ceramics ◽  
X Ray Diffraction ◽  
Implantable Medical Devices ◽  
Exothermic Reactions ◽  
Eds Analysis ◽  
Micron Size ◽  
History Of

Cofired platinum/ high temperature cofire ceramic (HTCC) alumina ceramic microsystems are emerging as a technology of choice for implantable medical devices due to the long reliable history of Pt wire /alumina ceramics use as feedthrough structures in pacemakers. This work evaluates the materials interactions developed in a platinum / alumina cofired materials system. Reactions previously unreported have been investigated, including the catalytic reaction with organic binders, the reduction of alumina into PtAl3 and the reduction of the melting point of platinum 300 – 500 °C below its melting point, independent of the particle size (nano to micron size particles) or particle morphology. High temperature X-ray diffraction and SEM with EDS analysis were used to characterize each of these reactions.

New Battery Possibilities for High-temperature Electronics

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 1-5
Author(s):  
Alexander A. Potanin
Keyword(s):  
High Temperature ◽  
Form Factors ◽  
Environmental Safety ◽  
Operational Capability ◽  
Emergency Situations ◽  
High Temperature Electronics ◽  
Micron Size ◽  
New Type ◽  
Harsh Conditions

This paper covers a new type of batteries that allows the following possibilities for high-temperature applications, namely: (a) safety and full operational capability at temperatures up to 275 °C (527 °F); (b) possibility of battery recharging at high temperatures; (c) full operational capability under severe industrial conditions (vibration, shock); (d) environmental safety under transportation, storage, use and disposal; (e) safety under harsh conditions including emergency situations as a fire (this has been demonstrated with discharge tests of battery prototypes placed in a diesel fuel fire). Two technological generations of the battery prototypes have been designed, fabricated and tested over an operating temperature range of 4 °C (39 °F) to 275 °C (527 °F). The battery prototypes have been also tested under super-harsh conditions. The variety of form-factors is available for this type of batteries, including for their application in MWD/LWD tools and long-term power supply of monitoring systems in producing wells. Efforts are underway to develop the third generation of the batteries of sub-micron size (micro-batteries for microelements including high-temperature ones).

Bonding strength of Cu/Cu joints using micro-sized Ag particle paste for high-temperature application

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000068-000072 ◽  
Author(s):  
H. Nishikawa ◽  
X. Liu ◽  
X. Wang ◽  
A. Fujita ◽  
N. Kamada ◽  
...  
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Interfacial Microstructure ◽  
Nitrogen Atmosphere ◽  
Sintering Behavior ◽  
Ag Particles ◽  
Temperature Application ◽  
Ag Particle ◽  
Component Assembly ◽  
Temperature Applications

High-temperature joining is a key technology for electronic component assembly and other high-temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a new joining technology for high-temperature applications. In this study, a feasibility study was conducted to determine whether chestnut-burr-like microscale Ag particles can be used for joint material, and the shear strength of the Cu-to-Cu joints was investigated. Then, the interfacial microstructure of the joints using the microscale particle paste was examined. As a result, joining using microscale Ag particles was successfully achieved and the shear strength of more than 20 MPa was obtained under nitrogen atmosphere.

The Effect of Thermal Aging on Nano-Particle Removal

2021 ◽  
Vol 314 ◽  
pp. 228-233
Author(s):  
Yeoho Kim ◽  
Seung Wan Jin ◽  
Hyun Tae Kim ◽  
Tae Gon Kim ◽  
Kyu Hwang Won ◽  
...  
Keyword(s):  
High Temperature ◽  
Local Variation ◽  
Local Deformation ◽  
Advanced Technology ◽  
Process Conditions ◽  
Particle Removal ◽  
Nano Particle ◽  
Adhesion Behavior ◽  
Micron Size ◽  
Technology Nodes

The cleanness of the wafer backside is vital in improving process quality and device yield for advanced technology nodes, 10, 7 nm, and beyond [1,2]. Defects such as particles and scratches on the wafer backside could be sources of local deformation of a wafer [2], causing the photolithography hotspot generation [3], the local variation of film thickness, wafer breakage, so on. The micron-size particle defects are easily generated during deposition, etch, CMP processes, and they can be easily transferred to subsequent processing tools. The particles will be exposed to various process conditions such as high compressive stress and high temperature, and it can be seen on the end-effector and wafer chuck in the process chamber. In order to make the wafer backside clean, we need to understand the behavior of particle adhesion and removal, especially at high temperature. In this paper, the adhesion behavior of aged particles at high temperature and the footprint of them were studied.

The anisotropic morphology of silver particles in Y-123/Y-24Nb1/Ag nanocomposite bulk high-temperature superconductors

2010 ◽  
Vol 25 (7) ◽  
pp. 1243-1250 ◽  
Author(s):  
S.K. Pathak ◽  
N.H. Babu ◽  
Y.H. Shi ◽  
A.R. Dennis ◽  
M. Strasik ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Flux Pinning ◽  
High Temperature Superconductors ◽  
Silver Particles ◽  
Ybco Bulk ◽  
Ag Particles ◽  
Composite Microstructure ◽  
Anisotropic Morphology ◽  
Particle Pushing

Y2Ba4CuNbO12 (Y-24Nb1) and silver (Ag) are recognized as potential candidates for improving both flux pinning and the mechanical properties of bulk rare earth (RE)–Ba–Cu–O [(RE)BCO] high-temperature superconductors (HTS). Recent attempts to add Ag2O to superconducting Y-123/Y2Ba4CuNbO12 composites, however, have produced a highly anisotropic morphology of Ag particles in samples grown by top-seeded melt growth (TSMG). This morphology has been attributed to strong particle pushing effects due to the presence of Y-24Nb1 nanoparticles in the composite microstructure. An investigation of the formation of anisotropic Ag particles in the YBCO bulk microstructure indicates that these pushing effects generate different morphological microstructural zones in the composite. These include a zone free of inclusions other than acicular Ag particles, a zone of segregated additives (i.e., Y-24Nb1, Y-211, and Ag), and a zone containing fine Ag and other particles distributed uniformly throughout the local microstructure. The particle pushing/trapping theory has been used to explain these extraordinary features of the distribution of Ag inclusions. The superconducting and mechanical properties of samples containing very fine silver inclusions are also discussed briefly.

Sign in / Sign up

Export Citation Format

Share Document