Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Robust loop parameters for ball neck strength enhancement [package wire bonding]

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.756022 ◽

2002 ◽

Author(s):

H. Liu ◽

S.H. Ong ◽

L.C. Tang

Keyword(s):

Wire Bonding ◽

Strength Enhancement ◽

Neck Strength

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Experimental investigations on a closed mini thermosyphon

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.755994 ◽

2002 ◽

Cited By ~ 4

Author(s):

Z.N. Ma ◽

C.B. Sobhan ◽

T.N. Wong ◽

X.Y. Huang

Keyword(s):

Experimental Investigations

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Eutectic Pb/Sn solder bump and under bump metallurgy interfacial reactions and adhesion

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.755981 ◽

2002 ◽

Cited By ~ 1

Author(s):

S.-Y. Jang ◽

K.-W. Paik

Keyword(s):

Solder Bump ◽

Interfacial Reactions

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Investigation of the adhesion strength between molding compound and leadframe at higher temperatures

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.756028 ◽

2002 ◽

Cited By ~ 5

Author(s):

R. Schmidt ◽

P. Alpern ◽

K. Plecher ◽

R. Tilgner

Keyword(s):

Adhesion Strength ◽

Molding Compound

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Compressible effects in microchannel flows [MEMS]

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.756006 ◽

2002 ◽

Cited By ~ 2

Author(s):

Q. Fan ◽

H. Xue

Keyword(s):

Microchannel Flows

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Vapor pressure analysis of popcorn cracking in plastic IC packages by fracture mechanics

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.755976 ◽

2002 ◽

Cited By ~ 6

Author(s):

J.H. Lim ◽

K.W. Lee ◽

S.S. Park ◽

Y.Y. Earmme

Keyword(s):

Fracture Mechanics ◽

Vapor Pressure ◽

Pressure Analysis

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Development of plastic chip scale package for ATM switching systems

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.755975 ◽

2002 ◽

Cited By ~ 1

Author(s):

A. Harada ◽

K. Kaizu ◽

N. Yamanaka ◽

T. Kawamura

Keyword(s):

Switching Systems ◽

Chip Scale Package

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A novel method for simultaneous switching noise analysis in electronic packages

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.755985 ◽

2002 ◽

Author(s):

J. Zhang ◽

M.K. Iyer ◽

B.L. Ooi ◽

M.S. Leong

Keyword(s):

Noise Analysis ◽

Electronic Packages ◽

Switching Noise ◽

Novel Method ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

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Thermal fatigue life prediction for solder joints with the consideration of damage evolution

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.756016 ◽

2002 ◽

Author(s):

X. Zhang ◽

S.-W.R. Lee

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Damage Evolution ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life

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A fast, low cost method to check for moisture in epoxy molding compound

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.756030 ◽

2002 ◽

Cited By ~ 1

Author(s):

J. Lin ◽

A. Teng ◽

M.M.F. Yuen

Keyword(s):

Low Cost ◽

Epoxy Molding Compound ◽

Molding Compound

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Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Robust loop parameters for ball neck strength enhancement [package wire bonding]

Experimental investigations on a closed mini thermosyphon

Eutectic Pb/Sn solder bump and under bump metallurgy interfacial reactions and adhesion

Investigation of the adhesion strength between molding compound and leadframe at higher temperatures

Compressible effects in microchannel flows [MEMS]

Vapor pressure analysis of popcorn cracking in plastic IC packages by fracture mechanics

Development of plastic chip scale package for ATM switching systems

A novel method for simultaneous switching noise analysis in electronic packages

Thermal fatigue life prediction for solder joints with the consideration of damage evolution

A fast, low cost method to check for moisture in epoxy molding compound

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
Latest Publications