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Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
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TOTAL DOCUMENTS
63
(FIVE YEARS 0)
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6
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Published By IEEE
078035141x
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Latest Documents
Most Cited Documents
Contributed Authors
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Robust loop parameters for ball neck strength enhancement [package wire bonding]
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
◽
10.1109/eptc.1998.756022
◽
2002
◽
Author(s):
H. Liu
◽
S.H. Ong
◽
L.C. Tang
Keyword(s):
Wire Bonding
◽
Strength Enhancement
◽
Neck Strength
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Vapor pressure analysis of popcorn cracking in plastic IC packages by fracture mechanics
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
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10.1109/eptc.1998.755976
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2002
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Cited By ~ 6
Author(s):
J.H. Lim
◽
K.W. Lee
◽
S.S. Park
◽
Y.Y. Earmme
Keyword(s):
Fracture Mechanics
◽
Vapor Pressure
◽
Pressure Analysis
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Development of plastic chip scale package for ATM switching systems
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
◽
10.1109/eptc.1998.755975
◽
2002
◽
Cited By ~ 1
Author(s):
A. Harada
◽
K. Kaizu
◽
N. Yamanaka
◽
T. Kawamura
Keyword(s):
Switching Systems
◽
Chip Scale Package
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A novel method for simultaneous switching noise analysis in electronic packages
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
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10.1109/eptc.1998.755985
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2002
◽
Author(s):
J. Zhang
◽
M.K. Iyer
◽
B.L. Ooi
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M.S. Leong
Keyword(s):
Noise Analysis
◽
Electronic Packages
◽
Switching Noise
◽
Novel Method
◽
Simultaneous Switching Noise
◽
Simultaneous Switching
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Experimental investigations on a closed mini thermosyphon
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
◽
10.1109/eptc.1998.755994
◽
2002
◽
Cited By ~ 4
Author(s):
Z.N. Ma
◽
C.B. Sobhan
◽
T.N. Wong
◽
X.Y. Huang
Keyword(s):
Experimental Investigations
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Eutectic Pb/Sn solder bump and under bump metallurgy interfacial reactions and adhesion
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
◽
10.1109/eptc.1998.755981
◽
2002
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Cited By ~ 1
Author(s):
S.-Y. Jang
◽
K.-W. Paik
Keyword(s):
Solder Bump
◽
Interfacial Reactions
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Investigation of the adhesion strength between molding compound and leadframe at higher temperatures
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
◽
10.1109/eptc.1998.756028
◽
2002
◽
Cited By ~ 5
Author(s):
R. Schmidt
◽
P. Alpern
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K. Plecher
◽
R. Tilgner
Keyword(s):
Adhesion Strength
◽
Molding Compound
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Compressible effects in microchannel flows [MEMS]
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
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10.1109/eptc.1998.756006
◽
2002
◽
Cited By ~ 2
Author(s):
Q. Fan
◽
H. Xue
Keyword(s):
Microchannel Flows
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Thermal fatigue life prediction for solder joints with the consideration of damage evolution
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
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10.1109/eptc.1998.756016
◽
2002
◽
Author(s):
X. Zhang
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S.-W.R. Lee
Keyword(s):
Fatigue Life
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Thermal Fatigue
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Damage Evolution
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Life Prediction
◽
Solder Joints
◽
Fatigue Life Prediction
◽
Thermal Fatigue Life
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A fast, low cost method to check for moisture in epoxy molding compound
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
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10.1109/eptc.1998.756030
◽
2002
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Cited By ~ 1
Author(s):
J. Lin
◽
A. Teng
◽
M.M.F. Yuen
Keyword(s):
Low Cost
◽
Epoxy Molding Compound
◽
Molding Compound
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