19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems
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9781424468652
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

High-speed I/O jitter modeling methodologies

2010 ◽  
Author(s):  
Jihong Ren ◽  
Dan Oh ◽  
Sam Chang
Keyword(s):  
High Speed

Proposal for BER based specifications for DDR4

2010 ◽  
Author(s):  
Santanu Chaudhuri ◽  
James A. McCall ◽  
Joe H. Salmon

Constructing 3D package component broadband electrical models with correct DC values

2010 ◽  
Author(s):  
Jinwoo Choi ◽  
Zhaoqing Chen ◽  
Wiren D. Becker ◽  
Jason Morsey ◽  
Barry Rubin
Keyword(s):  
3D Package

A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics

2010 ◽  
Author(s):  
Eakhwan Song ◽  
Jiseong Kim ◽  
Joungho Kim ◽  
Jeonghyeon Cho
Keyword(s):  
Low Cost ◽  
Wide Band

A study of reduced-terminal models for system-level SSO noise analysis

2010 ◽  
Author(s):  
Myunghyun Ha ◽  
Joong-Ho Kim ◽  
Dan Oh ◽  
Madhavan Swaminathan
Keyword(s):  
Noise Analysis ◽  
System Level

I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC

2010 ◽  
Author(s):  
Joohee Kim ◽  
Jonghyun Cho ◽  
Jun So Pak ◽  
Taigon Song ◽  
Joungho Kim ◽  
...  
Keyword(s):  
High Speed ◽  
Power Estimation ◽  
3D Ic ◽  
Through Silicon Via
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