19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems
Latest Publications

TOTAL DOCUMENTS

77

(FIVE YEARS 0)

H-INDEX

10

(FIVE YEARS 0)

Published By IEEE

9781424468652

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Design optimization of microstrip lines with via fences through surrogate modeling based on polynomial functional interpolants

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642562 ◽

2010 ◽

Author(s):

Jose E. Rayas-Sanchez ◽

Noel Vargas-Chavez

Keyword(s):

Design Optimization ◽

Surrogate Modeling ◽

Microstrip Lines

Download Full-text

High-speed I/O jitter modeling methodologies

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642559 ◽

2010 ◽

Author(s):

Jihong Ren ◽

Dan Oh ◽

Sam Chang

Keyword(s):

Download Full-text

Proposal for BER based specifications for DDR4

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642561 ◽

2010 ◽

Author(s):

Santanu Chaudhuri ◽

James A. McCall ◽

Joe H. Salmon

Download Full-text

Constructing 3D package component broadband electrical models with correct DC values

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642594 ◽

2010 ◽

Author(s):

Jinwoo Choi ◽

Zhaoqing Chen ◽

Wiren D. Becker ◽

Jason Morsey ◽

Barry Rubin

Keyword(s):

Download Full-text

Wide-range closed-form eddy-current loss formula for metal fill

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642563 ◽

2010 ◽

Author(s):

Steven G. Gaskill ◽

Vikas S. Shilimkar ◽

Andreas Weisshaar

Keyword(s):

Closed Form ◽

Eddy Current ◽

Eddy Current Loss ◽

Current Loss ◽

Download Full-text

Optimized waveform relaxation solution of electromagnetic and circuit problems

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642545 ◽

2010 ◽

Author(s):

Martin J. Gander ◽

Albert E. Ruehli

Keyword(s):

Waveform Relaxation ◽

Relaxation Solution

Download Full-text

A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642572 ◽

2010 ◽

Author(s):

Eakhwan Song ◽

Jiseong Kim ◽

Joungho Kim ◽

Jeonghyeon Cho

Keyword(s):

Low Cost ◽

Download Full-text

A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642532 ◽

2010 ◽

Author(s):

Bruce Su ◽

W. Shepherd Pitts ◽

Paul D. Franzon ◽

John Wilson

Keyword(s):

Power Consumption ◽

Capacitor Structure

Download Full-text

A study of reduced-terminal models for system-level SSO noise analysis

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642541 ◽

2010 ◽

Author(s):

Myunghyun Ha ◽

Joong-Ho Kim ◽

Dan Oh ◽

Madhavan Swaminathan

Keyword(s):

Noise Analysis ◽

Download Full-text

I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2010.5642539 ◽

2010 ◽

Author(s):

Joohee Kim ◽

Jonghyun Cho ◽

Jun So Pak ◽

Taigon Song ◽

Joungho Kim ◽

...

Keyword(s):

Power Estimation ◽

3D Ic ◽

Through Silicon Via

Download Full-text