2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Thermal characteristics of edge-illumination type LED backlight system in a thin flat panel display

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501355 ◽

2010 ◽

Cited By ~ 7

Author(s):

Sung Ki Kim ◽

Joon Kang ◽

Woo Young Kan ◽

Sang Hak Kim

Keyword(s):

Thermal Characteristics ◽

Flat Panel Display ◽

Flat Panel ◽

Led Backlight

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Numerical investigation of flow and heat transfer characteristics from an impinging jet on a circular cylinder

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501360 ◽

2010 ◽

Author(s):

Pedram Faghani ◽

Mehrdad Eskandari ◽

Ehsan Faghani

Keyword(s):

Heat Transfer ◽

Circular Cylinder ◽

Numerical Investigation ◽

Impinging Jet ◽

Heat Transfer Characteristics ◽

Transfer Characteristics ◽

Flow And Heat Transfer

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Analysis of spatial and temporal behavior of threedimensional multi-core architectures towards run-time thermal management

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501257 ◽

2010 ◽

Cited By ~ 1

Author(s):

E. Kursun ◽

J. Wakil ◽

M. Iyengar

Keyword(s):

Thermal Management ◽

Temporal Behavior ◽

Run Time

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An investigation into the solidification of nano-enhanced phase change material for transient thermal management of electronics

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501328 ◽

2010 ◽

Cited By ~ 1

Author(s):

Omar Sanusi ◽

Amy Fleischer ◽

Randy Weinstein

Keyword(s):

Phase Change ◽

Phase Change Material ◽

Thermal Management ◽

Thermal Management Of Electronics ◽

Transient Thermal ◽

Change Material

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Comprehensive evaluation of solder paste for assembly of PQFN packages

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501300 ◽

2010 ◽

Author(s):

Youmin Yu ◽

Sean Xu ◽

Victor Chiriac

Keyword(s):

Comprehensive Evaluation ◽

Solder Paste

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On refining the parameters of a Random Network Model for determining the effective thermal conductivity of particulate thermal interface materials

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501349 ◽

2010 ◽

Cited By ~ 5

Author(s):

B. Dan ◽

B.G. Sammakia ◽

G. Subbarayan

Keyword(s):

Thermal Conductivity ◽

Effective Thermal Conductivity ◽

Network Model ◽

Random Network ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

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Open side car heat exchanger that removes entire server heat load without any added fan power

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501423 ◽

2010 ◽

Cited By ~ 10

Author(s):

Roger Schmidt ◽

Madhu Iyengar ◽

Don Porter ◽

Gerry Weber ◽

David Graybill ◽

...

Keyword(s):

Heat Exchanger ◽

Heat Load ◽

Open Side

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Thermal zones for more efficient data center energy management

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501332 ◽

2010 ◽

Cited By ~ 16

Author(s):

Hendrik F. Hamann ◽

Vanessa Lopez ◽

Andrew Stepanchuk

Keyword(s):

Energy Management ◽

Data Center ◽

Efficient Data

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Thermo-mechanical reliability of SAC leadfree alloys

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501303 ◽

2010 ◽

Cited By ~ 1

Author(s):

Pradeep Lall ◽

Robert Hinshaw ◽

Ranjit Pandher ◽

Mahendra Harsha ◽

Jeff Suhling

Keyword(s):

Mechanical Reliability

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Thermoelectrics enhanced air cooling limits and improvement techniques: Experimental and computational studies

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2010.5501388 ◽

2010 ◽

Cited By ~ 1

Author(s):

H. Y. Zhang ◽

Y. C. Mui ◽

Gamal Refai-Ahmed

Keyword(s):

Air Cooling ◽

Computational Studies

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2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal characteristics of edge-illumination type LED backlight system in a thin flat panel display

Numerical investigation of flow and heat transfer characteristics from an impinging jet on a circular cylinder

Analysis of spatial and temporal behavior of threedimensional multi-core architectures towards run-time thermal management

An investigation into the solidification of nano-enhanced phase change material for transient thermal management of electronics

Comprehensive evaluation of solder paste for assembly of PQFN packages

On refining the parameters of a Random Network Model for determining the effective thermal conductivity of particulate thermal interface materials

Open side car heat exchanger that removes entire server heat load without any added fan power

Thermal zones for more efficient data center energy management

Thermo-mechanical reliability of SAC leadfree alloys

Thermoelectrics enhanced air cooling limits and improvement techniques: Experimental and computational studies

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2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal characteristics of edge-illumination type LED backlight system in a thin flat panel display

Numerical investigation of flow and heat transfer characteristics from an impinging jet on a circular cylinder

Analysis of spatial and temporal behavior of threedimensional multi-core architectures towards run-time thermal management

An investigation into the solidification of nano-enhanced phase change material for transient thermal management of electronics

Comprehensive evaluation of solder paste for assembly of PQFN packages

On refining the parameters of a Random Network Model for determining the effective thermal conductivity of particulate thermal interface materials

Open side car heat exchanger that removes entire server heat load without any added fan power

Thermal zones for more efficient data center energy management

Thermo-mechanical reliability of SAC leadfree alloys

Thermoelectrics enhanced air cooling limits and improvement techniques: Experimental and computational studies

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Latest Publications