2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424413355, 9781424413362

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Three Dimensional Flow Analysis During Injection Molding Process For Stacked-Die Packages

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417049 ◽

2007 ◽

Cited By ~ 2

Author(s):

Sung-won Moon ◽

Cheng Yang ◽

Zhihua Li ◽

Anthony Fischer

Keyword(s):

Injection Molding ◽

Flow Analysis ◽

Three Dimensional ◽

Injection Molding Process ◽

Molding Process ◽

Three Dimensional Flow ◽

Dimensional Flow

Download Full-text

Integrating Energy-saving Concept into General Product Design

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417085 ◽

2007 ◽

Cited By ~ 2

Author(s):

Hua Li ◽

Hong-chao Zhang ◽

John Carrell ◽

Derrick Tate

Keyword(s):

Energy Saving ◽

Product Design ◽

General Product

Download Full-text

Pb-free Solder: SAC105 vs SAC305 Drop-Test Reliability Data Comparison

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417072 ◽

2007 ◽

Cited By ~ 4

Author(s):

Ganesh Iyer ◽

Eric Ouyang ◽

Witoon Kittidacha ◽

Soratos Tantideeravit ◽

LK Suresh

Keyword(s):

Drop Test ◽

Test Reliability ◽

Reliability Data ◽

Data Comparison ◽

Free Solder

Download Full-text

Understanding the Cost Effectiveness of Embedded Technology

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417063 ◽

2007 ◽

Author(s):

Chet A. Palesko ◽

Alan C. Palesko

Keyword(s):

Cost Effectiveness ◽

Embedded Technology ◽

The Cost

Download Full-text

Work Instructions: Doing It Right the First Time

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417066 ◽

2007 ◽

Author(s):

Terry Chappell

Keyword(s):

First Time

Download Full-text

A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnection

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417065 ◽

2007 ◽

Cited By ~ 4

Author(s):

S. Mallik ◽

N. N. Ekere ◽

R. Durairaj ◽

A. E. Marks

Keyword(s):

Rheological Properties ◽

Flip Chip ◽

Lead Free ◽

Lead Free Solder ◽

Solder Paste ◽

Free Solder

Download Full-text

The Effect of Ni Thickness on Mechanical Strength of Pb-free BGA Spheres on Selectively Plated Ni/Au Finish

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417068 ◽

2007 ◽

Author(s):

Eu Poh Leng ◽

Min Ding ◽

Joah Rayos ◽

Ibrahim Ahmad ◽

Azman Jalar ◽

...

Keyword(s):

Mechanical Strength

Download Full-text

European Environmental Legislation - Insights into the EuP Process

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417083 ◽

2007 ◽

Cited By ~ 4

Author(s):

Nils F. Nissen ◽

Lutz Stobbe ◽

Karsten Schischke ◽

Jutta Muller ◽

Herbert Reichl

Keyword(s):

Environmental Legislation

Download Full-text

Impact of New Materials and Processes on Manufacturing: Green (Pb and halide free), RoHS experience

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417084 ◽

2007 ◽

Cited By ~ 1

Author(s):

Chandru Idnani

Keyword(s):

New Materials

Download Full-text

Wafer Level Hermetic Packaging of MOEMS Devices

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.2007.4417080 ◽

2007 ◽

Cited By ~ 3

Author(s):

Charles Yang ◽

Antai Xu ◽

Ye Wang

Keyword(s):

Wafer Level ◽

Hermetic Packaging

Download Full-text

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Three Dimensional Flow Analysis During Injection Molding Process For Stacked-Die Packages

Integrating Energy-saving Concept into General Product Design

Pb-free Solder: SAC105 vs SAC305 Drop-Test Reliability Data Comparison

Understanding the Cost Effectiveness of Embedded Technology

Work Instructions: Doing It Right the First Time

A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnection

The Effect of Ni Thickness on Mechanical Strength of Pb-free BGA Spheres on Selectively Plated Ni/Au Finish

European Environmental Legislation - Insights into the EuP Process

Impact of New Materials and Processes on Manufacturing: Green (Pb and halide free), RoHS experience

Wafer Level Hermetic Packaging of MOEMS Devices

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium
Latest Publications