2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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9781467316385, 9781467316354, 9781467316378
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Processing TSV wafer with stealth dicing technology

2012 ◽  
Author(s):  
Wan-Ting Chen ◽  
Mei-Chin Lee ◽  
Chun-Tang Lin ◽  
Ming-Hsien Yang ◽  
Jeng-Yuan Lai

Room temperature debonding — An enabling technology for TSV and 3D integration

2012 ◽  
Author(s):  
Thorsten Matthias ◽  
Gunter Pauzenberger ◽  
Juergen Burggraf ◽  
Daniel Burgstaller ◽  
Paul Lindner
Keyword(s):  
Room Temperature ◽  
Enabling Technology ◽  
3D Integration

Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film

2012 ◽  
Author(s):  
Kuo-Shu Kao ◽  
Ren-Shin Cheng ◽  
Chau-Jie Zhan ◽  
Jing-Yao Chang ◽  
Tsung-Fu Yang ◽  
...  
Keyword(s):  
Reliability Assessment ◽  
Wafer Level

Board-level signal integrity methodology

2012 ◽  
Author(s):  
Yuan-Liang Li ◽  
Kai Xiao ◽  
Xiaoning Ye ◽  
Yanjie Zhu ◽  
Edward Hsiung ◽  
...  
Keyword(s):  
Signal Integrity ◽  
Board Level

Development of UV-LIGA contact probe

2012 ◽  
Author(s):  
Hou-Jun Hsu ◽  
Jung-Tang Huang ◽  
Kuo-Yu Lee ◽  
Ting-Chiang Tsai
Keyword(s):  
Contact Probe
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