2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications

TOTAL DOCUMENTS

101

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467316385, 9781467316354, 9781467316378

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Room temperature debonding — An enabling technology for TSV and 3D integration

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420231 ◽

2012 ◽

Cited By ~ 3

Author(s):

Thorsten Matthias ◽

Gunter Pauzenberger ◽

Juergen Burggraf ◽

Daniel Burgstaller ◽

Paul Lindner

Keyword(s):

Room Temperature ◽

Enabling Technology ◽

3D Integration

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Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420249 ◽

2012 ◽

Author(s):

Kuo-Shu Kao ◽

Ren-Shin Cheng ◽

Chau-Jie Zhan ◽

Jing-Yao Chang ◽

Tsung-Fu Yang ◽

...

Keyword(s):

Reliability Assessment ◽

Wafer Level

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Board-level signal integrity methodology

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420251 ◽

2012 ◽

Cited By ~ 8

Author(s):

Yuan-Liang Li ◽

Kai Xiao ◽

Xiaoning Ye ◽

Yanjie Zhu ◽

Edward Hsiung ◽

...

Keyword(s):

Signal Integrity ◽

Board Level

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Wearout reliability study of Cu and Au wires used in flash memory fine line BGA package

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420213 ◽

2012 ◽

Cited By ~ 6

Author(s):

CL Gan ◽

EK Ng ◽

BL Chan ◽

T. Kwuanjai ◽

S. Jakarin ◽

...

Keyword(s):

Flash Memory ◽

Reliability Study ◽

Fine Line ◽

Bga Package

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Experimental study on the performance of compact heat sink for LSI packages

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420225 ◽

2012 ◽

Author(s):

Tomoyuki Hatakeyama ◽

Masaru Ishizuka ◽

Risako Kibushi

Keyword(s):

Experimental Study ◽

Heat Sink

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Silicon-based LED packaging module with photosensor

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420299 ◽

2012 ◽

Author(s):

Kuochun Tseng ◽

Chingfu Tsou

Keyword(s):

Silicon Based ◽

Packaging Module

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Processing TSV wafer with stealth dicing technology

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420262 ◽

2012 ◽

Cited By ~ 3

Author(s):

Wan-Ting Chen ◽

Mei-Chin Lee ◽

Chun-Tang Lin ◽

Ming-Hsien Yang ◽

Jeng-Yuan Lai

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Electroplating through holes with different geometry -- A novel and high productivity process for through hole fill plating

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420311 ◽

2012 ◽

Cited By ~ 2

Author(s):

Elie Najjar ◽

Leon Barstad ◽

Jayaraju Nagarajan ◽

Marc Lin ◽

Maria Rzeznik ◽

...

Keyword(s):

High Productivity ◽

Hole Fill ◽

Productivity Process ◽

Through Hole

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Critical parameter selection for thermal cycle of FBGA fatigue life

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420296 ◽

2012 ◽

Author(s):

You-Cheng Luo ◽

Mei-Ling Wu

Keyword(s):

Fatigue Life ◽

Thermal Cycle ◽

Critical Parameter ◽

Parameter Selection ◽

Selection For

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Development of UV-LIGA contact probe

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420275 ◽

2012 ◽

Cited By ~ 1

Author(s):

Hou-Jun Hsu ◽

Jung-Tang Huang ◽

Kuo-Yu Lee ◽

Ting-Chiang Tsai

Keyword(s):

Contact Probe

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2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Room temperature debonding — An enabling technology for TSV and 3D integration

Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film

Board-level signal integrity methodology

Wearout reliability study of Cu and Au wires used in flash memory fine line BGA package

Experimental study on the performance of compact heat sink for LSI packages

Silicon-based LED packaging module with photosensor

Processing TSV wafer with stealth dicing technology

Electroplating through holes with different geometry -- A novel and high productivity process for through hole fill plating

Critical parameter selection for thermal cycle of FBGA fatigue life

Development of UV-LIGA contact probe

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications