EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Latest Publications

TOTAL DOCUMENTS

106

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424421275, 9781424421282

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effect of thermomechanical stress on resonant frequency shift of a silicon MEMS resonator

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525078 ◽

2008 ◽

Cited By ~ 2

Author(s):

Mario Gonzalez ◽

Anne Jourdain ◽

Bart Vandevelde ◽

Harrie A. C. Tilmans

Keyword(s):

Resonant Frequency ◽

Frequency Shift ◽

Thermomechanical Stress ◽

Resonant Frequency Shift ◽

Mems Resonator

Investigation of thermal performance of various power-device packages

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525042 ◽

2008 ◽

Cited By ~ 1

Author(s):

Xuejun Fan ◽

Kyaw T. Aung ◽

X. Li

Keyword(s):

Thermal Performance ◽

Power Device

Advanced miniature mixed mode bending setup for in-situ interface delamination characterization

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525090 ◽

2008 ◽

Author(s):

M. Kolluri ◽

M. H. L. Thissen ◽

J. P. M. Hoefnagels ◽

J. A. W. van Dommelen ◽

M. G. D. Geers

Keyword(s):

Mixed Mode ◽

Interface Delamination

Optimisation of wirebond interconnects by automated parameter variation

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525044 ◽

2008 ◽

Author(s):

Stefan Martens ◽

Jurgen Wilde ◽

Elena Zukowski ◽

Friedemann Volklein ◽

Markus Ledermann

Keyword(s):

Parameter Variation

Parametric design of an electrostatic rotary microactuator using finite element analysis and metamodeling

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525076 ◽

2008 ◽

Cited By ~ 1

Author(s):

Jessica Bronson ◽

Irene Fassi

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Parametric Design ◽

Element Analysis

Sensitivity-maximizing and error-reducing design of a flow and thermal property sensor

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525021 ◽

2008 ◽

Cited By ~ 3

Author(s):

Ali Sukru Cubukcu ◽

Gerald A. Urban

Keyword(s):

Thermal Property

Correlating drop impact simulations with drop impact testing using high-speed camera measurements

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525029 ◽

2008 ◽

Cited By ~ 4

Author(s):

J. J. M. Zaal ◽

W. D. van Driel ◽

F. J. H. G. Kessels ◽

G. Q. Zhang

Keyword(s):

High Speed ◽

Drop Impact ◽

Impact Testing ◽

High Speed Camera ◽

Impact Simulations

PDF Not Yet Available In IEEE Xplore

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525102 ◽

2008 ◽

Influence of heat sink mounting procedure on package reliability

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525067 ◽

2008 ◽

Author(s):

Zhongfa Yuan ◽

Yong Liu ◽

Timwah Luk ◽

Scott Irving

Keyword(s):

Heat Sink ◽

Package Reliability

Electromigration induced failure mechanism: Multiphysics model and correlation with experiments

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ◽

10.1109/esime.2008.4525025 ◽

2008 ◽

Cited By ~ 4

Author(s):

F. Cacho ◽

V. Fiori ◽

L. Doyen ◽

C. Chappaz ◽

C. Tavernier ◽

...

Keyword(s):

Failure Mechanism

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Effect of thermomechanical stress on resonant frequency shift of a silicon MEMS resonator

Investigation of thermal performance of various power-device packages

Advanced miniature mixed mode bending setup for in-situ interface delamination characterization

Optimisation of wirebond interconnects by automated parameter variation

Parametric design of an electrostatic rotary microactuator using finite element analysis and metamodeling

Sensitivity-maximizing and error-reducing design of a flow and thermal property sensor

Correlating drop impact simulations with drop impact testing using high-speed camera measurements

PDF Not Yet Available In IEEE Xplore

Influence of heat sink mounting procedure on package reliability

Electromigration induced failure mechanism: Multiphysics model and correlation with experiments

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Latest Publications