2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Determination of relevant material behavior for use in stretchable electronics

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369902 ◽

2018 ◽

Author(s):

H. Walter ◽

A. Grams ◽

M. Seckel ◽

Th. Loher ◽

O. Wittler ◽

...

Keyword(s):

Material Behavior ◽

Stretchable Electronics ◽

Relevant Material

Automation of electro-thermal simulations based on thermal conductivity optimization

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369872 ◽

2018 ◽

Cited By ~ 3

Author(s):

A. Datsuk ◽

M. Kaynak ◽

T. Krupkina

Keyword(s):

Thermal Conductivity ◽

Thermal Simulations

Simulation-based design of a micro fluidic transportation system for mobile applications based on ultrasonic actuation

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369873 ◽

2018 ◽

Author(s):

M. Seidl ◽

M. Gehring ◽

U. Krumbein ◽

G. Schrag

Keyword(s):

Mobile Applications ◽

Transportation System ◽

Simulation Based Design ◽

Simulation Based

Simulation-based lifetime curve for a power module to extend parameter regime beyond testing limitations

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369886 ◽

2018 ◽

Author(s):

Tatyana Kashko ◽

Oliver Schilling

Keyword(s):

Power Module ◽

Simulation Based ◽

Lifetime Curve

Modeling the effects of imposed current on the creep of SAC305 solder material

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369919 ◽

2018 ◽

Author(s):

Peter Varga ◽

Andrew Rusinko

Keyword(s):

Sac305 Solder ◽

Solder Material

Low cycle fatigue of aluminium thin films on vibrating silicon MEMS cantilevers: Highly accelerated stress test and finite element modelling

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369941 ◽

2018 ◽

Author(s):

Georg M. Reuther ◽

Reinhard Pufall ◽

Bernhard Wunderle

Keyword(s):

Thin Films ◽

Finite Element ◽

Finite Element Modelling ◽

Low Cycle Fatigue ◽

Stress Test ◽

Cycle Fatigue ◽

Element Modelling ◽

Accelerated Stress Test ◽

Mems Cantilevers

Design and test of a 3D printed acoustic fresnel lens

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369933 ◽

2018 ◽

Author(s):

G. B. Torri ◽

M. Signorelli ◽

C. H. Huang ◽

R. Haouari ◽

S. Mao ◽

...

Keyword(s):

Fresnel Lens ◽

3D Printed

Reliability assessment of SiC power module stack based on thermo-structural analysis

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369879 ◽

2018 ◽

Cited By ~ 2

Author(s):

Alexey Sokolov ◽

Chunlei Liu ◽

Fabian Mohn

Keyword(s):

Structural Analysis ◽

Reliability Assessment ◽

Power Module

Parametric model order reduction of a thermoelectric generator for electrically active implants

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369946 ◽

2018 ◽

Cited By ~ 1

Author(s):

Cheng Dong Yuan ◽

Onkar Sandip Jadhav ◽

Evgenii B. Rudnyi ◽

Dennis Hohlfeld ◽

Tamara Bechtold

Keyword(s):

Model Order Reduction ◽

Thermoelectric Generator ◽

Order Reduction ◽

Parametric Model ◽

Model Order ◽

Parametric Model Order Reduction

A tunable THz wave modulator based on graphene

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2018.8369951 ◽

2018 ◽

Author(s):

Feng Zhang ◽

Xian-Ping Chen ◽

Qi-qin Wei ◽

Li-Bo Yuan ◽

Miao Cai ◽

...

Keyword(s):

Thz Wave

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Determination of relevant material behavior for use in stretchable electronics

Automation of electro-thermal simulations based on thermal conductivity optimization

Simulation-based design of a micro fluidic transportation system for mobile applications based on ultrasonic actuation

Simulation-based lifetime curve for a power module to extend parameter regime beyond testing limitations

Modeling the effects of imposed current on the creep of SAC305 solder material

Low cycle fatigue of aluminium thin films on vibrating silicon MEMS cantilevers: Highly accelerated stress test and finite element modelling

Design and test of a 3D printed acoustic fresnel lens

Reliability assessment of SiC power module stack based on thermo-structural analysis

Parametric model order reduction of a thermoelectric generator for electrically active implants

A tunable THz wave modulator based on graphene

Export Citation Format

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Determination of relevant material behavior for use in stretchable electronics

Automation of electro-thermal simulations based on thermal conductivity optimization

Simulation-based design of a micro fluidic transportation system for mobile applications based on ultrasonic actuation

Simulation-based lifetime curve for a power module to extend parameter regime beyond testing limitations

Modeling the effects of imposed current on the creep of SAC305 solder material

Low cycle fatigue of aluminium thin films on vibrating silicon MEMS cantilevers: Highly accelerated stress test and finite element modelling

Design and test of a 3D printed acoustic fresnel lens

Reliability assessment of SiC power module stack based on thermo-structural analysis

Parametric model order reduction of a thermoelectric generator for electrically active implants

A tunable THz wave modulator based on graphene

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications