Power Module/SiP/3D/Stack/Embedded Packaging Design and Considerations

2011 ◽  
pp. 89-166
Author(s):  
Yong Liu
Keyword(s):  
Power Module ◽  
Packaging Design

A study on packaging design of SiC power module using near-field magnetic scanning techniques

2017 ◽  
Author(s):  
Takaaki Ibuchi ◽  
Eisuke Masuda ◽  
Tsuyoshi Funaki ◽  
Hirotaka Otake ◽  
Tatsuya Miyazaki ◽  
...  
Keyword(s):  
Near Field ◽  
Power Module ◽  
Packaging Design

Integrated Microchannel Cooling for Power Electronic Modules

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000122-000129 ◽  
Author(s):  
Wenli Zhang ◽  
Fengchang Yang ◽  
Rui Qiao ◽  
Dushan Boroyevich
Keyword(s):  
Thermal Management ◽  
System Level ◽  
Maximum Temperature ◽  
Bottom Surface ◽  
Power Electronic ◽  
Power Module ◽  
Packaging Design ◽  
Power Modules ◽  
Average Maximum ◽  
Microchannel Cooling

Abstract The power electronic module plays a key role in the power system by providing the needed physical support, electrical contact and insulation, and thermal pathway for power devices. Using wide bandgap power semiconductors in the power modules enables high-frequency and low-loss switching at relatively high temperatures for efficient power conversion. These advantages could lead to an increase in power-density for the power module as well as a reduction of cost, weight, and volume at the system level. However, the highly integrated power module requires advanced thermal management solutions for effective heat removal from the active chips to achieve high reliability. The evaluation of thermal performance for the power module is critical for its packaging design, because most of the heat generated by the semiconductors is dissipated through the module package. It is even more critical for the gallium nitride (GaN)-based power modules due to the lower thermal conductivity of the GaN material compared with that of silicon and silicon carbide. This paper provides a brief introduction of power modules in conventional packaging design and a review of several new packaging structures with advanced thermal management solutions. The direct-bonded-copper (DBC) substrate with integrated microchannel cooling designed for a new packaging structure is proposed for highly integrated power modules. In this design, the cooling microchannels are embedded inside the aluminum nitride (AlN) layer of the DBC substrate. In finite element analysis (FEA) simulation model of the new package, six high-voltage GaN transistors are arranged on the top surface of the DBC substrate to realize a three-phase inverter circuit. Three straight embedded microchannels with a cross-sectional area of 0.3 mm × 5 mm are located underneath the GaN devices. The average maximum temperature of the GaN devices in the new package is around 72 °C (50 W power loss applied on each die), which is about 16 °C lower than that in the traditional power module package. A thermal transfer coefficient of 2000 W/m2 K, which is equivalent to the liquid cooling condition, is applied on the bottom surface of the baseplate in the traditional package. Enhanced heat dissipation capability is demonstrated using this integrated microchannel cooling method. Further study will focus on the fabrication of a prototype and experimental testing.

Communicating the Value of Design

2019 ◽  
Vol 2 (1) ◽  
Author(s):  
George Edward TORRENS ◽  
Nicholas Samuel JOHNSON ◽  
Ian STORER
Keyword(s):  
Design Decision ◽  
Card Sorting ◽  
Practical Application ◽  
Product Packaging ◽  
Sorting Method ◽  
Packaging Design ◽  
Design Considerations ◽  
Modified Delphi ◽  
Fast Moving Consumer Goods ◽  
Comprehensive Framework

Product packaging design is often produced through the practical application of tacit knowledge, rule of thumb and professional connoisseurship. Stakeholders are becoming increasingly demanding that design practitioners provide clarity of reasoning and accountability for their design proposals. Therefore, a better framework for the design of fast-moving consumer goods (FMCG) is required. This paper proposes a comprehensive taxonomy of ‘design considerations’ to assist the development of low involvement FMCG packaging and aid in rationale communication for design solutions. 302 academic sources were reviewed, inductive content analysis performed to code topics and output validation with academic and industry experts (n=9) through a modified-Delphi card sorting method. The research provides movement towards a comprehensive framework and common dialogue between stakeholders, practitioners and managers to assist in more effectively communicating the value that design can offer to FMCGs. The constructed taxonomy provides a set of 156 ‘design considerations’ to support in objective and informed design decision-making.

Development of a 30 GHz-band 20 W microwave power module

1998 ◽  
Author(s):  
Takatsugu Munehiro ◽  
Kurao Nakagawa ◽  
Junichi Matsuoka ◽  
Hajime Fukui
Keyword(s):  
Microwave Power ◽  
Power Module

Scientific and engineering problems involved in the implementation of the project «Manned space systems and complexes»

2019 ◽  
pp. 5-19
Author(s):  
Yevgeny A. Mikrin
Keyword(s):  
Program Completion ◽  
Search And Rescue ◽  
Current Status ◽  
Space Systems ◽  
Power Module ◽  
Orbital Station ◽  
Launch Site ◽  
New Instrumentation ◽  
Manned Space ◽  
Manned Spaceflight

This paper, which is, to a large extent, a review, presents results of an analysis of the current status and future prospects for the development of our country’s manned spaceflight from the standpoint of RSC Energia as the prime organization in Russia in this field of science and engineering. It addresses the issues involved in the ISS Russian Segment deployment completion, which is to be achieved by the addition of three new modules currently being developed at RSC Energia: the Multipurpose Laboratory Module in 2020; the Node Module in 2021; Science and Power Module in 2022, and the development of an improved version of cargo spacecraft Progress-MS. It describes quick ISS rendezvous profiles for crew and cargo transportation spacecraft. It discusses the issues involved in improving the efficiency of the ISS Russian Segment utilization, commercialization problems and plans to expand scientific applied research. The paper explores the desirability of establishing a Russian orbital station after the ISS program completion. As a strategic outlook for the development of our country’s manned space flight the paper formulates proposals on the national program of lunar research and exploration. It summarizes RSC Energia’s proposals on the development of a multifunctional system for crew search and rescue during launches of manned spacecraft from Vostochny launch site. It discusses the results and problems involved in laying the scientific, engineering and manufacturing groundwork for the development of advanced manned space systems, including introduction of digital technologies, development of new instrumentation, use of composite materials, additive and robotic technologies. Key words: Manned spaceflight, ISS Russian Segment, commercialization of scientific research, Russian orbital station, lunar research and exploration program, crew search and rescue system, problems of laying the scientific and engineering groundwork.

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