With the growing demands on the performance, cost, and advances in packaging and interconnection technology, three-dimensional (3D) packaging provides higher density packaging. On the other hand, thermal management of the 3D package becomes a very important issue. This paper assesses the various possibilities of integrated thermal management for integrated power electronics modules (IPEMs).
Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm$^2$ Heat Dissipation
