2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Fundamental study on subcooled boiling of binary mixture of anti-freezing liquid toward advanced cooling technology for a SiC-based on-vehicle inverter

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517549 ◽

2016 ◽

Cited By ~ 3

Author(s):

Tadashi Furusho ◽

Kazuhisa Yuki ◽

Koichi Suzuki

Keyword(s):

Binary Mixture ◽

Subcooled Boiling ◽

Fundamental Study ◽

Cooling Technology ◽

Freezing Liquid

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Temperature estimation of high temperature data acquisition multichip module for oil field apparatus

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517553 ◽

2016 ◽

Cited By ~ 1

Author(s):

Xianglong Meng ◽

Guangwei Wang ◽

Hui Cao ◽

Shuang Gao ◽

Jingjng Cheng

Keyword(s):

High Temperature ◽

Data Acquisition ◽

Temperature Data ◽

Oil Field ◽

Multichip Module ◽

Temperature Estimation ◽

High Temperature Data

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Performance comparison of electrowetting heat pipe for extended distance heat transport

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517657 ◽

2016 ◽

Cited By ~ 1

Author(s):

Renee S. Hale ◽

Vaibhav Bahadur

Keyword(s):

Heat Pipe ◽

Heat Transport ◽

Performance Comparison

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De-bonding simulation of Cu-Al wire bond intermetallic compound layers

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517637 ◽

2016 ◽

Author(s):

Pradeep Lall ◽

Yihua Luo ◽

Luu Nguyen

Keyword(s):

Intermetallic Compound ◽

Wire Bond

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Thermoelectric package design for high ambient temperature electronics cooling

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517636 ◽

2016 ◽

Cited By ~ 3

Author(s):

Ram Ranjan ◽

Matthew R. Pearson ◽

Shashank Krishnamurthy

Keyword(s):

Ambient Temperature ◽

Electronics Cooling ◽

High Ambient Temperature ◽

Package Design

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Thermal management and safety regulation of smart watches

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517646 ◽

2016 ◽

Cited By ~ 2

Author(s):

Angel Qian Han

Keyword(s):

Thermal Management ◽

Safety Regulation

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Dynamic compact thermal modeling of package-on-package by thermal resistor-capacitor ladder

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517554 ◽

2016 ◽

Cited By ~ 2

Author(s):

Tai-Yu Chen ◽

Sheng-Liang Kuo ◽

Jih-Ming Hsu ◽

Chi-Wen Pan

Keyword(s):

Thermal Modeling ◽

Thermal Resistor ◽

Compact Thermal Modeling

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Replicating impinging synthetic jets as a train of consecutive viscous Lamb-Ossen vortex pairs

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517645 ◽

2016 ◽

Author(s):

Luis Silva-Llanca

Keyword(s):

Synthetic Jets ◽

Vortex Pairs

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Proportional Hazard Model of doped low creep lead free solder paste under thermal shock

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517683 ◽

2016 ◽

Cited By ~ 8

Author(s):

Anto Raj ◽

Sivasubramanian Thirugnanasambandam ◽

Thomas Sanders ◽

Sharath Sridhar ◽

Seth Gordon ◽

...

Keyword(s):

Thermal Shock ◽

Hazard Model ◽

Lead Free ◽

Lead Free Solder ◽

Solder Paste ◽

Proportional Hazard ◽

Proportional Hazard Model ◽

Free Solder

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Survivability assessment of electronics subjected to mechanical shocks up to 25,000g

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517591 ◽

2016 ◽

Cited By ~ 7

Author(s):

Pradeep Lall ◽

Kalyan Dornala ◽

Ryan Lowe ◽

Jason Foley

Keyword(s):

Mechanical Shocks

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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Fundamental study on subcooled boiling of binary mixture of anti-freezing liquid toward advanced cooling technology for a SiC-based on-vehicle inverter

Temperature estimation of high temperature data acquisition multichip module for oil field apparatus

Performance comparison of electrowetting heat pipe for extended distance heat transport

De-bonding simulation of Cu-Al wire bond intermetallic compound layers

Thermoelectric package design for high ambient temperature electronics cooling

Thermal management and safety regulation of smart watches

Dynamic compact thermal modeling of package-on-package by thermal resistor-capacitor ladder

Replicating impinging synthetic jets as a train of consecutive viscous Lamb-Ossen vortex pairs

Proportional Hazard Model of doped low creep lead free solder paste under thermal shock

Survivability assessment of electronics subjected to mechanical shocks up to 25,000g

Export Citation Format

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Fundamental study on subcooled boiling of binary mixture of anti-freezing liquid toward advanced cooling technology for a SiC-based on-vehicle inverter

Temperature estimation of high temperature data acquisition multichip module for oil field apparatus

Performance comparison of electrowetting heat pipe for extended distance heat transport

De-bonding simulation of Cu-Al wire bond intermetallic compound layers

Thermoelectric package design for high ambient temperature electronics cooling

Thermal management and safety regulation of smart watches

Dynamic compact thermal modeling of package-on-package by thermal resistor-capacitor ladder

Replicating impinging synthetic jets as a train of consecutive viscous Lamb-Ossen vortex pairs

Proportional Hazard Model of doped low creep lead free solder paste under thermal shock

Survivability assessment of electronics subjected to mechanical shocks up to 25,000g

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications