A computational study of PCB layer orientation of WCSP assembly under temperature dependent drop impact loading
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2018 ◽
Vol 188
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pp. 656-675
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Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull
2009 ◽
Vol 49
(8)
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pp. 846-852
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2008 ◽
Vol 22
(31n32)
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pp. 5572-5577
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