2009 IEEE International Interconnect Technology Conference
Latest Publications

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82

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8

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Published By IEEE

9781424444922, 9781424444939

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Low resistive and highly reliable copper interconnects in combination of silicide-cap with Ti-barrier for 32 nm-node and beyond

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090401 ◽

2009 ◽

Author(s):

Y. Hayashi ◽

N. Matsunaga ◽

M. Wada ◽

S. Nakao ◽

K. Watanabe ◽

...

Keyword(s):

Copper Interconnects

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Back-end-of-line integration approaches for resistive memories

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090335 ◽

2009 ◽

Author(s):

V. Jousseaume ◽

J. Buckley ◽

Y. Bernard ◽

P. Gonon ◽

C. Vallee ◽

...

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A self-aligned airgap interconnect scheme

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090367 ◽

2009 ◽

Author(s):

Hsien-Wei Chen ◽

Shin-Puu Jeng ◽

Hao-Yi Tsai ◽

Yu-Wen Liu ◽

Hsiu-Ping Wei ◽

...

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Novel dielectric deposition technology for advanced interconnect with air gap

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090333 ◽

2009 ◽

Author(s):

Jacques Faguet ◽

Eric Lee ◽

Junjun Liu ◽

Jozef Brcka ◽

Osayuki Akiyama

Keyword(s):

Air Gap ◽

Deposition Technology

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TSV-aware interconnect length and power prediction for 3D stacked ICs

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090331 ◽

2009 ◽

Author(s):

Dae Hyun Kim ◽

Saibal Mukhopadhyay ◽

Sung Kyu Lim

Keyword(s):

Power Prediction

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Electrode and substrate contacts in carbon nanofiber interconnects

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090360 ◽

2009 ◽

Author(s):

Tsutomu Saito ◽

Hisashi Yabutani ◽

Toshishige Yamada ◽

Patrick Wilhite ◽

Cary Y. Yang

Keyword(s):

Carbon Nanofiber

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A new physical model and experimental measurements of copper interconnect resistivity considering size effects and line-edge roughness (LER)

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090396 ◽

2009 ◽

Author(s):

Gerald Lopez ◽

Jeffrey Davis ◽

James Meindl

Keyword(s):

Physical Model ◽

Size Effects ◽

Experimental Measurements ◽

Line Edge Roughness ◽

Copper Interconnect ◽

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Study of low resistance TSV using electroless plated copper and tungsten-alloy barrier

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090376 ◽

2009 ◽

Author(s):

F. Inoue ◽

T. Yokoyama ◽

S. Tanaka ◽

K. Yamamoto ◽

M. Koyanagi ◽

...

Keyword(s):

Tungsten Alloy ◽

Low Resistance ◽

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Advanced BEOL integration using porous low-k (k=2.25) material with charge damage-less electron beam cure technique

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090368 ◽

2009 ◽

Author(s):

T. Owada ◽

N. Ohara ◽

H. Watatani ◽

T. Kouno ◽

H. Kudo ◽

...

Keyword(s):

Electron Beam ◽

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[Front matter]

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090322 ◽

2009 ◽

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