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2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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TOTAL DOCUMENTS
47
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2
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Published By IEEE
9781538630556
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Latest Documents
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Enhanced heat transport in printed circuit boards via passive components embedding
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993170
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2017
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Author(s):
Jonathan Silvano de Sousa
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Paul Fulmek
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Michael Unger
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Peter Haumer
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Johann Nicolics
Keyword(s):
Heat Transport
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Printed Circuit Boards
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Circuit Boards
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Passive Components
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Printed Circuit
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[Title page]
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993130
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2017
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Keyword(s):
Title Page
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[Copyright notice]
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993131
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2017
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Keyword(s):
Copyright Notice
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Low temperature and high quality atomic layer deposition HfO2 coatings
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993189
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2017
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Author(s):
Alexander Pyymaki Perros
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Perttu Sippola
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Elisa Arduca
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Leena-Sisko Johansson
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Harri Lipsanen
Keyword(s):
Low Temperature
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Atomic Layer Deposition
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Atomic Layer
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High Quality
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Layer Deposition
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D-band waveguide transition based on Linearly Tapered Slot Antenna
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993166
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2017
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Cited By ~ 1
Author(s):
Ahmed Hassona
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Zhongxia Simon He
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Vessen Vassilev
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Herbert Zirath
Keyword(s):
Slot Antenna
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Waveguide Transition
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Fabrication and characterization of screen printed stretchable carbon interconnects
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993169
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2017
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Cited By ~ 1
Author(s):
Mahmoud Mosallaei
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Behnam Khorramdel
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Mari Honkanen
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Pekka Iso-Ketola
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Jukka Vanhala
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...
Keyword(s):
Fabrication And Characterization
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Screen Printed
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SMARTER-SI - Smart access to manufacturing for Systems Integration
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993157
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2017
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Cited By ~ 1
Author(s):
Dag Andersson
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Petra Weiler
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Kepa Mayora
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Michael Kunze
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Rainer Gunzler
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...
Keyword(s):
Systems Integration
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Graphene-based heat spreading materials for electronics packaging applications
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993187
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2017
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Author(s):
Guangjie Yuan
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Bo Shan
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Shujing Chen
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Yiqun Yang
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Jie Bao
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...
Keyword(s):
Electronics Packaging
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Heat Spreading
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Solder joint reliability analysis of wafer level CSP
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993179
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2017
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Cited By ~ 1
Author(s):
Yin Wen
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Liu Hai Yan
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Lin Tingyu
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Aaron Zhang Feng
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Li Ming Yu
Keyword(s):
Solder Joint
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Reliability Analysis
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Wafer Level
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Solder Joint Reliability
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Joint Reliability
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Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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10.1109/nordpac.2017.7993177
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2017
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Author(s):
Yiqun Yang
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Hui Ye
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Wei Ke
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Shirong Huang
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Nan Wang
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...
Keyword(s):
Electronic Packaging
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Heat Dissipation
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Conductive Adhesive
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Electrically Conductive
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Electrically Conductive Adhesive
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