MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series
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Published By Springer New York

9781461402091, 9781461402107

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Full-Field Bulge Testing Using Global Digital Image Correlation

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_14 ◽

2011 ◽

pp. 99-103

Author(s):

Jan Neggers ◽

Johan Hoefnagels ◽

François Hild ◽

Stéphane Roux ◽

Marc Geers

Keyword(s):

Digital Image Correlation ◽

Digital Image ◽

Image Correlation ◽

Full Field ◽

Bulge Testing

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Characterization of a Variation on AFIT’s Tunable MEMS Cantilever Array Metamaterial

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_16 ◽

2011 ◽

pp. 111-118

Author(s):

Matthew E. Jussaume ◽

Peter J. Collins ◽

Ronald A. Coutu

Keyword(s):

Cantilever Array

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Analytical approach for the determination of nanomechanical properties for metals

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_10 ◽

2011 ◽

pp. 65-73 ◽

Cited By ~ 1

Author(s):

Kaushal K Jha ◽

Nakin Suksawang ◽

Arvind Agarwal

Keyword(s):

Analytical Approach ◽

Nanomechanical Properties

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MEMS for real-time infrared imaging

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_17 ◽

2011 ◽

pp. 119-124 ◽

Cited By ~ 2

Author(s):

I. Dobrev ◽

Marc Balboa ◽

Ryan Fossett ◽

C. Furlong ◽

E. J. Harrington

Keyword(s):

Real Time ◽

Infrared Imaging

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Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_8 ◽

2011 ◽

pp. 53-57

Author(s):

Jae Hun Kim ◽

Andrew Gouldstone ◽

Chad S. Korach

Keyword(s):

Spherical Indentation ◽

Perturbation Approach

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Micromechanical Structure With Stable Linear Positive And Negative Stiffness

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_20 ◽

2011 ◽

pp. 137-143 ◽

Cited By ~ 2

Author(s):

Jeffrey P. Baugher ◽

Ronald A. Coutu

Keyword(s):

Negative Stiffness ◽

Stable Linear

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New Insight into Pile-up in Thin Film Indentation

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_6 ◽

2011 ◽

pp. 39-43

Author(s):

B. C. Prorok ◽

B. Frye ◽

B. Zhou ◽

K. Schwieker

Keyword(s):

Thin Film ◽

Pile Up ◽

Insight Into

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The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_5 ◽

2011 ◽

pp. 31-38

Author(s):

K.-S. Hsu ◽

M.-T. Lin ◽

C.-J. Tong

Keyword(s):

Thin Film ◽

Creep Behavior ◽

Cyclic Creep ◽

Copper Thin Film ◽

Microtensile Testing

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A nano-tensile tester for creep studies

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_4 ◽

2011 ◽

pp. 25-29 ◽

Cited By ~ 1

Author(s):

L. I. J. C. Bergers ◽

J. P. M. Hoefnagels ◽

E. C. A. Dekkers ◽

M. G. D. Geers

Keyword(s):

Tensile Tester

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Analysis and Evaluation Methods Associated with the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0210-7_26 ◽

2011 ◽

pp. 177-187

Author(s):

John Torok ◽

Shawn Canfield ◽

David Edwards ◽

David Olson ◽

Michael Gaynes ◽

...

Keyword(s):

Evaluation Methods ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Analysis And Evaluation ◽

Electronic Board ◽

Interface Materials

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MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics SeriesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer New York

Full-Field Bulge Testing Using Global Digital Image Correlation

Characterization of a Variation on AFIT’s Tunable MEMS Cantilever Array Metamaterial

Analytical approach for the determination of nanomechanical properties for metals

MEMS for real-time infrared imaging

Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach

Micromechanical Structure With Stable Linear Positive And Negative Stiffness

New Insight into Pile-up in Thin Film Indentation

The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing

A nano-tensile tester for creep studies

Analysis and Evaluation Methods Associated with the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies

MEMS and Nanotechnology, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series
Latest Publications