Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

Lead-free piezoelectric 0.95(Na0.49K0.49Li0.02)(Nb0.8Ta0.2)O3–0.05CaZrO3 with 2 wt % MnO2 addition was prepared using mechanochemically-assisted solid-state synthesis. Upon mechanochemical activation of the mixture of reagents partial amorphization occurs which contributes to a significantly lower temperature of completion of the solid-state reaction, ~600 °C as opposed to ~700 °C for the conventional solid-state synthesis as determined by thermal analysis. The ceramic specimens prepared by the mechanochemically-assisted route exhibit improved compositional homogeneity and slightly enhanced piezoelectric properties, achieved in a considerably shorter processing time compared to the conventional solid-state synthesis route, which was studied as a reference.

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Morphology and Intermetallic Study of (Sn-8Zn-3Bi)-1Ni Solder under Liquid State Aging

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.1087.162 ◽

2015 ◽

Vol 1087 ◽

pp. 162-166

Author(s):

Nor Aishah Jasli ◽

Hamidi Abd Hamid ◽

Ramani Mayappan

Keyword(s):

Liquid State ◽

Copper Substrate ◽

Lead Free ◽

Lead Free Solder ◽

Reflow Time ◽

Intermetallic Formation ◽

X Ray ◽

Ni Addition ◽

Free Solder ◽

Scanning Electron

This study investigated the effect of Ni addition on intermetallic formation in the Sn-8Zn-3Bi solder under liquid state aging. The intermetallic compounds were formed by reacting the solder alloy with copper substrate. Different reflow time was used at temperature 220°C. Morphology of the phases formed was observed using scanning electron microscope (SEM) and in order to determine elemental compositions of the phases, energy dispersive x-ray (EDX) was used. The formation of the reaction layer led by Cu5Zn8 intermetallic and then followed by Cu6Sn5 and Cu3Sn when reflow time increases. Keywords: lead free solder, intermetallic, Cu5Zn8, Cu6Sn5, liquid state aging.

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Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_8 ◽

2011 ◽

pp. 179-195 ◽

Cited By ~ 1

Author(s):

P.-E. Tegehall

Keyword(s):

Solder Joints ◽

Electroless Nickel ◽

Electroless Nickel Immersion Gold ◽

Black Pad ◽

Intermetallic Layers

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A high temperature stable piezoelectric strain of KNN-based ceramics

Journal of Materials Chemistry A ◽

10.1039/c8ta07908k ◽

2018 ◽

Vol 6 (41) ◽

pp. 19967-19973 ◽

Cited By ~ 13

Author(s):

Zhenyong Cen ◽

Yu Huan ◽

Wei Feng ◽

Yan Yu ◽

Peiyao Zhao ◽

...

Keyword(s):

High Temperature ◽

Solid State ◽

Solid State Reaction ◽

Piezoelectric Ceramics ◽

Solid State Reaction Method ◽

Lead Free ◽

Conventional Solid State Reaction ◽

Reaction Method ◽

Piezoelectric Strain

Lead-free (1 − x)(0.96K0.46Na0.54Nb0.98Ta0.02O3–0.04Bi0.5(Na0.82K0.18)0.5ZrO3)–xCaZrO3 ((1 − x)(0.96KNNT–0.04BNKZ)–xCZ) piezoelectric ceramics were prepared by the conventional solid-state reaction method.

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Enhanced energy storage properties of a novel lead-free ceramic with a multilayer structure

Journal of Materials Chemistry C ◽

10.1039/c8tc02368a ◽

2018 ◽

Vol 6 (29) ◽

pp. 7905-7912 ◽

Cited By ~ 45

Author(s):

Fei Yan ◽

Haibo Yang ◽

Lin Ying ◽

Tong Wang

Keyword(s):

Energy Storage ◽

Solid State ◽

Multilayer Structure ◽

Tape Casting ◽

Lead Free ◽

Solid State Sintering ◽

Energy Storage Properties ◽

Lead Free Ceramic ◽

Sintering Method ◽

Storage Properties

A (SrTiO3 + Li2CO3)/(0.94Bi0.54Na0.46TiO3 − 0.06BaTiO3) (STL/BNBT) lead-free ceramic with a multilayer structure was shaped via the tape-casting and subsequent lamination technique, and sintered using the conventional solid state sintering method.

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