Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Latch-up at RAM control circuitry

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638329 ◽

2002 ◽

Cited By ~ 1

Author(s):

Chua Yong Chiang

Keyword(s):

Latch Up

Applications of atomic force microscopy for semiconductor device and package characterization

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638349 ◽

2002 ◽

Author(s):

M. Natarajan ◽

C.Q. Cui ◽

D.P. Poener ◽

M.K. Radhakrishnan

Keyword(s):

Atomic Force Microscopy ◽

Semiconductor Device ◽

Force Microscopy ◽

Atomic Force

A new method for the localisation of metallization defects using cathodoluminescence imaging

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638343 ◽

2002 ◽

Author(s):

X. Liu ◽

J.C.H. Phang ◽

D.S.H. Chan ◽

W.K. Chim

Keyword(s):

New Method ◽

Cathodoluminescence Imaging

Fast first-run silicon repair cases by laser chemical vapor deposition of copper from Cu(hfac)tmvs

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638353 ◽

2002 ◽

Author(s):

J. Remes ◽

H. Moilanen ◽

S. Leppavuori

Keyword(s):

Chemical Vapor Deposition ◽

Vapor Deposition ◽

Chemical Vapor ◽

Laser Chemical Vapor Deposition

Cathodoluminescence evaluation of electrical stress condition of Si-SiO/sub 2/ structures

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638345 ◽

2002 ◽

Author(s):

X. Liu ◽

D.S.H. Chan ◽

J.C.H. Phang ◽

W.K. Chim

Keyword(s):

Stress Condition ◽

Electrical Stress

Direct BSIM3v3 parameter extraction for hot-carrier reliability simulation of N-channel LDD MOSFETs

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638176 ◽

2002 ◽

Author(s):

S. Minehane ◽

S. Healy ◽

P. O'Sullivan ◽

K. McCarthy ◽

A. Mathewson ◽

...

Keyword(s):

Parameter Extraction ◽

Hot Carrier

Charging identification and compensation in the scanning electron microscope

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638151 ◽

2002 ◽

Author(s):

W.K. Wong ◽

J.T.L. Thong ◽

J.C.H. Phang

Keyword(s):

Electron Microscope ◽

Scanning Electron Microscope ◽

Scanning Electron

Signature analysis based IC diagnostics-a statistician's perspective

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638191 ◽

2002 ◽

Author(s):

C.K. Lakshminarayan ◽

S. Pabbisetty ◽

Chien-Pai Han

Keyword(s):

Signature Analysis

Functional failure analysis on analog device by optical beam induced current technique

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638367 ◽

2002 ◽

Cited By ~ 2

Author(s):

K.T. Tan ◽

S.H. Tan ◽

S.H. Ong

Keyword(s):

Failure Analysis ◽

Optical Beam ◽

Induced Current ◽

Analog Device ◽

Functional Failure ◽

Current Technique ◽

Optical Beam Induced Current

Investigation for lateral diecrack on SIP power device

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1997.638211 ◽

2002 ◽

Cited By ~ 1

Author(s):

C.S. Premachandran ◽

E.M. Palmeda ◽

T.C. Chai

Keyword(s):

Power Device

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated CircuitsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Latch-up at RAM control circuitry

Applications of atomic force microscopy for semiconductor device and package characterization

A new method for the localisation of metallization defects using cathodoluminescence imaging

Fast first-run silicon repair cases by laser chemical vapor deposition of copper from Cu(hfac)tmvs

Cathodoluminescence evaluation of electrical stress condition of Si-SiO/sub 2/ structures

Direct BSIM3v3 parameter extraction for hot-carrier reliability simulation of N-channel LDD MOSFETs

Charging identification and compensation in the scanning electron microscope

Signature analysis based IC diagnostics-a statistician's perspective

Functional failure analysis on analog device by optical beam induced current technique

Investigation for lateral diecrack on SIP power device

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits
Latest Publications